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IXFH30N50P

Specifications

SKU: 6362808

BUY IXFH30N50P https://www.utsource.net/itm/p/6362808.html
PolarHV HiPerFET Power MOSFET
Parameter Symbol Value Unit
Maximum Drain Voltage VDS(max) 500 V
Maximum Gate-Source Voltage VGS(max) ±20 V
Maximum Drain Current (Tc=25°C) ID(max) 30 A
Maximum Drain Current (Tc=100°C) ID(max) 24 A
Maximum Power Dissipation (Tc=25°C) PTOT(max) 300 W
Maximum Power Dissipation (Tc=100°C) PTOT(max) 240 W
Junction Temperature Range TJ -55 to +150 °C
Storage Temperature Range TSTG -55 to +150 °C

Instructions for Use:

  1. Handling Precautions:

    • Handle the IXFH30N50P with care to avoid damage to the leads and body.
    • Use appropriate ESD protection to prevent damage from static electricity.
  2. Mounting:

    • Ensure that the mounting surface is clean and flat.
    • Apply thermal paste or a thermal pad to enhance heat dissipation.
    • Tighten the mounting screws to the recommended torque to ensure good thermal contact.
  3. Electrical Connections:

    • Connect the drain (D), gate (G), and source (S) terminals correctly.
    • Use short and direct connections to minimize parasitic inductance and resistance.
    • Ensure that the gate drive circuitry is designed to provide the necessary voltage levels and current to switch the MOSFET efficiently.
  4. Thermal Management:

    • The device should be mounted on a heatsink to maintain the junction temperature within safe limits.
    • Calculate the required heatsink size based on the power dissipation and ambient temperature.
  5. Operating Conditions:

    • Do not exceed the maximum ratings specified in the table.
    • Operate the device within the recommended operating conditions to ensure reliable performance and longevity.
  6. Testing:

    • Before final assembly, test the device in a controlled environment to verify its functionality and performance.
    • Use appropriate test equipment and follow safety guidelines to avoid damage to the device or injury.
  7. Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat.
    • Keep the device in its original packaging until ready for use to protect it from moisture and physical damage.
(For reference only)

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