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ADUM1411BRW

Specifications

SKU: 6369064

BUY ADUM1411BRW https://www.utsource.net/itm/p/6369064.html

Parameter Symbol Min Typ Max Unit Notes
Supply Voltage (Input Side) VIN 3.0 - 5.5 V
Supply Voltage (Output Side) VOUT 2.7 - 5.5 V
Channel-to-Channel Isolation VIso - - 2500 VRMS Continuous
Data Rate fDATA - 150 - Mbps
Propagation Delay tpd - 40 - ns
Skew tskew - 4 - ns
Operating Temperature Range TA -40 - 125 °C
Storage Temperature Range TSTG -65 - 150 °C
Power Consumption ICC - 1.5 - mA

Instructions for Use:

  1. Power Supply:

    • Ensure that the input and output supply voltages (VIN and VOUT) are within the specified range of 3.0V to 5.5V.
    • The input and output sides can be powered independently, but ensure they do not exceed the maximum voltage difference.
  2. Isolation:

    • The ADUM1411BRW provides channel-to-channel isolation up to 2500VRMS. This ensures safety and reliability in high-voltage applications.
  3. Data Transmission:

    • The device supports data rates up to 150 Mbps. Ensure that the signal integrity is maintained by using appropriate PCB layout techniques and termination resistors if necessary.
    • The propagation delay is typically 40 ns, and the skew between channels is typically 4 ns. These parameters should be considered in timing-critical applications.
  4. Temperature Considerations:

    • The operating temperature range is from -40°C to 125°C. Ensure that the device is used within this range to avoid damage or performance degradation.
    • The storage temperature range is from -65°C to 150°C. Store the device in a controlled environment to prevent damage.
  5. Power Consumption:

    • The typical power consumption is 1.5 mA. Ensure that the power supply can handle this current draw.
  6. Handling and Storage:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Store the device in a dry and cool place to prevent moisture damage.
  7. Mounting and Assembly:

    • Follow the recommended PCB layout guidelines provided in the datasheet to ensure optimal performance and reliability.
    • Use appropriate soldering techniques to avoid thermal stress on the device during assembly.
  8. Testing:

    • After assembly, perform functional tests to verify the correct operation of the device. Check for proper power supply levels, signal integrity, and isolation performance.

For more detailed information, refer to the ADUM1411BRW datasheet available from Analog Devices.

(For reference only)

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