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K9GAG08UOE-PCBO

Specifications

SKU: 6393128

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Parameter Description
Product Name K9GAG08UOE-PCBO
Type NAND Flash Memory
Density 128 Gb (16 GB)
Organization 16 Die Stacked
Interface Toggle Mode 2.0
Vcc (Supply Voltage) 1.8V ± 0.1V
I/O Voltage 1.8V or 3.3V
Data Rate Up to 400 MB/s
Package BGA (Ball Grid Array)
Pin Count 169 pins
Operating Temperature -40°C to +85°C
Endurance 3,000 Program/Erase Cycles
Retention 10 years at 25°C
ECC Requirement Up to 40 bits per 1024 bytes
Data Bus Width 8-bit or 16-bit (x8/x16)
Write Protect Software and Hardware Write Protect
Package Size 16 mm x 12 mm x 1.2 mm

Instructions for Use

  1. Power Supply:

    • Ensure that the supply voltage (Vcc) is within the range of 1.8V ± 0.1V.
    • The I/O voltage can be either 1.8V or 3.3V, depending on your system requirements.
  2. Data Transfer:

    • The data rate can reach up to 400 MB/s. Ensure that your system can support this speed to avoid performance bottlenecks.
  3. Temperature Range:

    • The operating temperature range is from -40°C to +85°C. Ensure that the device is used within this range to prevent damage.
  4. Endurance:

    • The device is rated for 3,000 program/erase cycles. Plan your usage accordingly to maximize the lifespan of the memory.
  5. Data Retention:

    • Data retention is guaranteed for 10 years at 25°C. Store the device in a cool, dry place to maintain data integrity.
  6. Error Correction Code (ECC):

    • The ECC requirement is up to 40 bits per 1024 bytes. Ensure that your system has the necessary ECC capabilities to correct errors during data transfer.
  7. Data Bus Configuration:

    • The device supports both 8-bit and 16-bit data bus widths. Configure your system to match the desired bus width.
  8. Write Protection:

    • Use the software and hardware write protect features to prevent accidental data overwrite.
  9. Physical Handling:

    • Handle the BGA package with care to avoid damaging the balls or the package itself. Follow standard ESD (Electrostatic Discharge) precautions.
  10. Soldering:

    • Follow the recommended soldering profile provided by the manufacturer to ensure proper attachment of the BGA package to the PCB.

For detailed specifications and additional information, refer to the datasheet provided by the manufacturer.

(For reference only)

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