Share:


MC33269T-12

Specifications

SKU: 6418577

BUY MC33269T-12 https://www.utsource.net/itm/p/6418577.html
mA LOW DROPOUT THREE-TERMINAL VOLTAGE REGULATORS
Parameter Symbol Conditions Min Typ Max Unit
Output Voltage Vout - 12.0 - 12.0 V
Line Regulation ΔVout/ΔVin 5.0V ≤ Vin ≤ 30V, Iout = 0mA to 1.5A - 4 - mV
Load Regulation ΔVout/ΔIout Vin = 24V, Iout = 0mA to 1.5A - 15 - mV
Dropout Voltage Vdo Iout = 1.5A, TJ = 25°C - 1.8 - V
Quiescent Current IQ Vin = 24V, Iout = 0mA - 5 - mA
Short-Circuit Current Limit Ilim Vin = 24V, TJ = 25°C - 1.8 - A
Thermal Shutdown Temperature TSD - - 175 - °C
Operating Junction Temperature Range TJ - -40 - 150 °C
Storage Temperature Range Tstg - -65 - 150 °C

Instructions for Use:

  1. Circuit Design:

    • Ensure the input voltage (Vin) is within the specified range (5.0V to 30V).
    • Connect a suitable output capacitor (typically 10μF to 100μF) between the output and ground to stabilize the output voltage.
    • Use an input capacitor (typically 10μF) between the input and ground to filter out noise and transients.
  2. Thermal Management:

    • The device has an internal thermal shutdown feature that activates at 175°C. However, it is recommended to keep the junction temperature below 150°C for reliable operation.
    • If the device is expected to dissipate significant power, consider using a heatsink or other cooling methods.
  3. Short-Circuit Protection:

    • The device includes short-circuit protection, which limits the output current to approximately 1.8A. In case of a short circuit, the output current will be limited, and the device will automatically shut down if the temperature exceeds the thermal shutdown threshold.
  4. Output Voltage Adjustment:

    • The MC33269T-12 is fixed at 12V output. For adjustable output voltages, consider using a different variant of the MC33269 series.
  5. Storage and Handling:

    • Store the device in a dry, cool environment within the storage temperature range (-65°C to 150°C).
    • Handle the device with care to avoid damage to the leads and the body of the component.
  6. Mounting:

    • Solder the device to the PCB using standard soldering techniques. Ensure that the soldering iron is set to a temperature that will not exceed the maximum junction temperature of the device.
    • Verify proper alignment and orientation of the device before soldering.
  7. Testing:

    • After mounting, test the output voltage under no-load and full-load conditions to ensure the device is functioning correctly.
    • Monitor the temperature of the device during operation to ensure it remains within safe limits.
(For reference only)

 Inquiry - MC33269T-12