Specifications
SKU: 6418577
mA LOW DROPOUT THREE-TERMINAL VOLTAGE REGULATORS
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Output Voltage | Vout | - | 12.0 | - | 12.0 | V |
Line Regulation | ΔVout/ΔVin | 5.0V ≤ Vin ≤ 30V, Iout = 0mA to 1.5A | - | 4 | - | mV |
Load Regulation | ΔVout/ΔIout | Vin = 24V, Iout = 0mA to 1.5A | - | 15 | - | mV |
Dropout Voltage | Vdo | Iout = 1.5A, TJ = 25°C | - | 1.8 | - | V |
Quiescent Current | IQ | Vin = 24V, Iout = 0mA | - | 5 | - | mA |
Short-Circuit Current Limit | Ilim | Vin = 24V, TJ = 25°C | - | 1.8 | - | A |
Thermal Shutdown Temperature | TSD | - | - | 175 | - | °C |
Operating Junction Temperature Range | TJ | - | -40 | - | 150 | °C |
Storage Temperature Range | Tstg | - | -65 | - | 150 | °C |
Instructions for Use:
Circuit Design:
- Ensure the input voltage (Vin) is within the specified range (5.0V to 30V).
- Connect a suitable output capacitor (typically 10μF to 100μF) between the output and ground to stabilize the output voltage.
- Use an input capacitor (typically 10μF) between the input and ground to filter out noise and transients.
Thermal Management:
- The device has an internal thermal shutdown feature that activates at 175°C. However, it is recommended to keep the junction temperature below 150°C for reliable operation.
- If the device is expected to dissipate significant power, consider using a heatsink or other cooling methods.
Short-Circuit Protection:
- The device includes short-circuit protection, which limits the output current to approximately 1.8A. In case of a short circuit, the output current will be limited, and the device will automatically shut down if the temperature exceeds the thermal shutdown threshold.
Output Voltage Adjustment:
- The MC33269T-12 is fixed at 12V output. For adjustable output voltages, consider using a different variant of the MC33269 series.
Storage and Handling:
- Store the device in a dry, cool environment within the storage temperature range (-65°C to 150°C).
- Handle the device with care to avoid damage to the leads and the body of the component.
Mounting:
- Solder the device to the PCB using standard soldering techniques. Ensure that the soldering iron is set to a temperature that will not exceed the maximum junction temperature of the device.
- Verify proper alignment and orientation of the device before soldering.
Testing:
- After mounting, test the output voltage under no-load and full-load conditions to ensure the device is functioning correctly.
- Monitor the temperature of the device during operation to ensure it remains within safe limits.
Inquiry - MC33269T-12