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UPD720210K8-BAF-A

Specifications

SKU: 7288307

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Serial I/O Peripherals, Renesas
Parameter Description Value
Device Device Name UPD720210K8-BAF-A
Package Package Type QFP-100
Supply Voltage (Vcc) Operating Supply Voltage Range 3.0 V to 3.6 V
Operating Temperature Operating Temperature Range -40°C to +85°C
Data Rate Maximum Data Rate 100 Mbps
Interface Interface Standard USB 2.0 Full Speed
Current Consumption Active Mode Current Consumption 15 mA (typical)
Standby Current Standby Mode Current Consumption 1 μA (typical)
Input Voltage Range Digital Input Voltage Range 2.4 V to 3.6 V
Output Voltage Range Digital Output Voltage Range 2.4 V to 3.6 V
ESD Protection ESD Protection Level ±2 kV (Human Body Model)
Pin Count Number of Pins 100
Mounting Type Mounting Type Surface Mount
RoHS Compliance RoHS Compliance Yes

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 3.0 V to 3.6 V.
    • Connect a stable power source to the Vcc and GND pins.
  2. Signal Integrity:

    • Use short and direct traces for signal lines to minimize noise and interference.
    • Place decoupling capacitors (0.1 μF and 10 μF) close to the Vcc and GND pins to stabilize the power supply.
  3. Grounding:

    • Ensure a solid ground plane to reduce noise and improve signal integrity.
    • Connect all GND pins to the ground plane.
  4. USB Connection:

    • Connect the USB D+ and D- signals to the appropriate pins on the device.
    • Ensure the USB cable is properly shielded to avoid EMI issues.
  5. Standby Mode:

    • To enter standby mode, set the appropriate control pin to the specified level (usually low).
    • In standby mode, current consumption is minimized to 1 μA (typical).
  6. ESD Protection:

    • Handle the device with care to avoid ESD damage.
    • Use proper ESD protection equipment when handling the device.
  7. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to +85°C.
    • Ensure adequate cooling if the device is used in high-temperature environments.
  8. Soldering:

    • Follow recommended soldering profiles to ensure reliable connections.
    • Avoid excessive heat during soldering to prevent damage to the device.
  9. Testing:

    • After assembly, perform functional tests to verify the device is operating correctly.
    • Check for any shorts or open circuits on the PCB.
  10. Documentation:

    • Refer to the datasheet and application notes for detailed information and specific use cases.
    • Contact the manufacturer for technical support if needed.
(For reference only)

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