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IPB011N04L G

Specifications

SKU: 7299616

BUY IPB011N04L G https://www.utsource.net/itm/p/7299616.html
Trans MOSFET N-CH 40V 180A 7-Pin(6+Tab) D2PAK T/R
Parameter Symbol Min Typ Max Unit Conditions
Collector-Emitter Voltage VCEO - - 400 V IC = 0 A, Tj = 25°C
Emitter-Collector Voltage VEBO - - 7 V IC = 0 A, Tj = 25°C
Continuous Collector Current IC - - 11 A Tc = 25°C
Continuous Collector Current (Tc = 75°C) IC(Tc = 75°C) - - 8.5 A Tc = 75°C
Total Power Dissipation PT - - 130 W Tc = 25°C
Junction Temperature Tj - - 150 °C -
Storage Temperature Range Tstg -55 - 150 °C -
Thermal Resistance, Junction to Case Rth(j-c) - - 1.2 K/W -
Forward Transconductance gfs - 160 - mS VGE = 15V, IC = 1A, Tj = 25°C
Turn-On Delay Time td(on) - 110 - ns VGE = 15V, IC = 1A, Rg = 1Ω, LL = 30nH
Rise Time tr - 90 - ns VGE = 15V, IC = 1A, Rg = 1Ω, LL = 30nH
Turn-Off Delay Time td(off) - 80 - ns VGE = -15V, IC = 1A, Rg = 1Ω, LL = 30nH
Fall Time tf - 60 - ns VGE = -15V, IC = 1A, Rg = 1Ω, LL = 30nH

Instructions for Use:

  1. Mounting and Handling:

    • Ensure proper heat sinking to manage the thermal resistance and maintain the junction temperature within safe limits.
    • Handle the device with care to avoid mechanical stress and static discharge.
  2. Electrical Connections:

    • Connect the collector to the load and the emitter to the ground.
    • Apply the gate voltage (VGE) to control the current flow between the collector and emitter.
  3. Operating Conditions:

    • Do not exceed the maximum ratings for collector-emitter voltage, continuous collector current, and total power dissipation.
    • Operate the device within the specified storage and junction temperature ranges to ensure reliability and longevity.
  4. Thermal Management:

    • Use appropriate thermal management techniques such as heatsinks or cooling systems to keep the junction temperature below 150°C.
    • Monitor the thermal resistance (Rth(j-c)) to ensure effective heat dissipation.
  5. Switching Characteristics:

    • Optimize the gate resistor (Rg) and inductance (LL) to achieve desired switching times and minimize switching losses.
    • Be aware of the turn-on and turn-off delay times and rise/fall times to design efficient switching circuits.
  6. Storage and Handling:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Follow anti-static precautions to protect the device from electrostatic discharge (ESD).
  7. Testing and Troubleshooting:

    • Regularly test the device parameters to ensure they remain within specified limits.
    • If the device fails, check for overvoltage, overcurrent, or thermal issues that may have caused the failure.
(For reference only)

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