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XC7Z010-1CLG225C

Specifications

SKU: 7386018

BUY XC7Z010-1CLG225C https://www.utsource.net/itm/p/7386018.html
Dual ARM? Cortex?-A9 MPCore? with CoreSight? System On Chip (SOC) IC Zynq?-7000 Artix?-7 FPGA, 28K Logic Cells 256KB 667MHz 225-CSPBGA (13x13)
Parameter Description Value/Range
Device Part Number XC7Z010-1CLG225C
Family Zynq-7000 All Programmable SoC -
Package Ceramic Ball Grid Array (CBGA) 225-Pin
Speed Grade -1 (Commercial) -
Operating Temperature Commercial: 0°C to 85°C -
Configuration Memory Non-volatile Flash -
FPGA Logic Cells Total Number of Logic Cells 28,000
Block RAM Total Block RAM (Kbits) 2,880
DSP Slices Total Number of DSP Slices 90
I/O Banks Number of I/O Banks 16
I/O Standards Supported LVCMOS, SSTL, HSTL, LVDS, etc. -
Clock Managers PLLs (Phase-Locked Loops) 2
ARM Cortex-A9 Processors Dual-core ARM Cortex-A9 MP (Multi-Processor) -
L1 Cache 32 KB Instruction Cache, 32 KB Data Cache per core -
L2 Cache 512 KB Shared L2 Cache -
Memory Interfaces DDR3, DDR2, LPDDR2, QDRII+, QDRII, RLDRAM II, etc. -
PCIe Interface PCIe Gen1 x1, x2, x4 -
USB Interface USB 2.0 OTG (On-The-Go) -
Ethernet MAC 10/100/1000 Ethernet MAC -
SD/SDIO Interface SD/SDIO/MMC 3.0 -
CAN Interface CAN 2.0B -
I2C Interface I2C -
SPI Interface SPI -
GPIO General Purpose Input/Output Pins -
Power Supply VCCINT: 1.0V, VCCAUX: 1.8V, VCCO: 1.8V or 3.3V (per bank) -
Power Consumption Typical Power Consumption (mW) Varies based on configuration and use
Package Size 19x19 mm -

Instructions for Use:

  1. Power Supply Configuration:

    • Ensure that all required power supplies (VCCINT, VCCAUX, VCCO) are correctly configured and stable before applying power to the device.
    • Use appropriate decoupling capacitors near the power supply pins to minimize noise.
  2. Configuration:

    • The device can be configured using a variety of methods including JTAG, SelectMAP, and BPI (Byte Parallel Interface).
    • Refer to the Xilinx documentation for specific configuration details and recommended settings.
  3. Clock Management:

    • Utilize the onboard PLLs to generate the required clock frequencies for both the FPGA and ARM processors.
    • Ensure that clock signals are properly routed and terminated to avoid skew and jitter issues.
  4. I/O Configuration:

    • Configure I/O standards and drive strengths according to the requirements of the connected devices.
    • Use the I/O banks appropriately to match the voltage levels of external interfaces.
  5. Thermal Management:

    • Monitor the operating temperature to ensure it stays within the specified range.
    • Use heat sinks or other cooling solutions if necessary to maintain thermal integrity.
  6. Software Development:

    • Use Xilinx Vivado Design Suite for FPGA design and programming.
    • Use Xilinx SDK (Software Development Kit) for developing software for the ARM Cortex-A9 processors.
  7. Debugging:

    • Utilize JTAG and on-chip debug features for troubleshooting and debugging both hardware and software.
    • Use the Xilinx ChipScope Pro tool for real-time monitoring and analysis of internal signals.
  8. Documentation:

    • Refer to the Xilinx Zynq-7000 All Programmable SoC Technical Reference Manual (TRM) and User Guides for detailed information and best practices.

For more detailed information, refer to the official Xilinx documentation and datasheets.

(For reference only)

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