Specifications
SKU: 7386018
Dual ARM? Cortex?-A9 MPCore? with CoreSight? System On Chip (SOC) IC Zynq?-7000 Artix?-7 FPGA, 28K Logic Cells 256KB 667MHz 225-CSPBGA (13x13)
Parameter | Description | Value/Range |
---|---|---|
Device | Part Number | XC7Z010-1CLG225C |
Family | Zynq-7000 All Programmable SoC | - |
Package | Ceramic Ball Grid Array (CBGA) | 225-Pin |
Speed Grade | -1 (Commercial) | - |
Operating Temperature | Commercial: 0°C to 85°C | - |
Configuration Memory | Non-volatile Flash | - |
FPGA Logic Cells | Total Number of Logic Cells | 28,000 |
Block RAM | Total Block RAM (Kbits) | 2,880 |
DSP Slices | Total Number of DSP Slices | 90 |
I/O Banks | Number of I/O Banks | 16 |
I/O Standards Supported | LVCMOS, SSTL, HSTL, LVDS, etc. | - |
Clock Managers | PLLs (Phase-Locked Loops) | 2 |
ARM Cortex-A9 Processors | Dual-core ARM Cortex-A9 MP (Multi-Processor) | - |
L1 Cache | 32 KB Instruction Cache, 32 KB Data Cache per core | - |
L2 Cache | 512 KB Shared L2 Cache | - |
Memory Interfaces | DDR3, DDR2, LPDDR2, QDRII+, QDRII, RLDRAM II, etc. | - |
PCIe Interface | PCIe Gen1 x1, x2, x4 | - |
USB Interface | USB 2.0 OTG (On-The-Go) | - |
Ethernet MAC | 10/100/1000 Ethernet MAC | - |
SD/SDIO Interface | SD/SDIO/MMC 3.0 | - |
CAN Interface | CAN 2.0B | - |
I2C Interface | I2C | - |
SPI Interface | SPI | - |
GPIO | General Purpose Input/Output Pins | - |
Power Supply | VCCINT: 1.0V, VCCAUX: 1.8V, VCCO: 1.8V or 3.3V (per bank) | - |
Power Consumption | Typical Power Consumption (mW) | Varies based on configuration and use |
Package Size | 19x19 mm | - |
Instructions for Use:
Power Supply Configuration:
- Ensure that all required power supplies (VCCINT, VCCAUX, VCCO) are correctly configured and stable before applying power to the device.
- Use appropriate decoupling capacitors near the power supply pins to minimize noise.
Configuration:
- The device can be configured using a variety of methods including JTAG, SelectMAP, and BPI (Byte Parallel Interface).
- Refer to the Xilinx documentation for specific configuration details and recommended settings.
Clock Management:
- Utilize the onboard PLLs to generate the required clock frequencies for both the FPGA and ARM processors.
- Ensure that clock signals are properly routed and terminated to avoid skew and jitter issues.
I/O Configuration:
- Configure I/O standards and drive strengths according to the requirements of the connected devices.
- Use the I/O banks appropriately to match the voltage levels of external interfaces.
Thermal Management:
- Monitor the operating temperature to ensure it stays within the specified range.
- Use heat sinks or other cooling solutions if necessary to maintain thermal integrity.
Software Development:
- Use Xilinx Vivado Design Suite for FPGA design and programming.
- Use Xilinx SDK (Software Development Kit) for developing software for the ARM Cortex-A9 processors.
Debugging:
- Utilize JTAG and on-chip debug features for troubleshooting and debugging both hardware and software.
- Use the Xilinx ChipScope Pro tool for real-time monitoring and analysis of internal signals.
Documentation:
- Refer to the Xilinx Zynq-7000 All Programmable SoC Technical Reference Manual (TRM) and User Guides for detailed information and best practices.
For more detailed information, refer to the official Xilinx documentation and datasheets.
(For reference only)Inquiry - XC7Z010-1CLG225C