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STK621-061-E

Specifications

SKU: 7427767

BUY STK621-061-E https://www.utsource.net/itm/p/7427767.html
Half Bridge (3) Driver AC Motors IGBT
Parameter Symbol Min Typical Max Unit
Supply Voltage Vcc 4.5 5.0 5.5 V
Output Current (Continuous) Iout - 1.5 3.0 A
Peak Output Current Ipeak - 5.0 - A
Quiescent Current Iq - 0.5 1.0 mA
Operating Temperature Toper -40 - 85 °C
Storage Temperature Tstg -55 - 150 °C
Thermal Resistance (Junction to Ambient) Rθja - 50 - °C/W
Protection Features - - Overcurrent, Overtemperature - -

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage is within the specified range of 4.5V to 5.5V to avoid damage to the device.
  2. Output Current:

    • The device can provide a continuous output current up to 1.5A with a peak current capability of up to 5.0A. Ensure that the load does not exceed these limits to prevent overheating or damage.
  3. Quiescent Current:

    • The quiescent current is typically 0.5mA and should not exceed 1.0mA under normal operating conditions.
  4. Operating Temperature:

    • The device is designed to operate within a temperature range of -40°C to 85°C. Avoid exposing the device to temperatures outside this range to ensure reliable operation.
  5. Storage Temperature:

    • When storing the device, keep it within a temperature range of -55°C to 150°C to prevent degradation of performance.
  6. Thermal Management:

    • The thermal resistance from the junction to ambient is 50°C/W. Proper heat sinking may be required for applications where high power dissipation is expected.
  7. Protection Features:

    • The device includes overcurrent and overtemperature protection to safeguard against common fault conditions. However, it is still important to design the circuit to minimize the risk of these faults occurring.
  8. Mounting:

    • Follow recommended PCB layout guidelines to ensure proper thermal management and electrical performance. Use appropriate soldering techniques to avoid damage to the device during assembly.
  9. Handling:

    • Handle the device with care to avoid mechanical stress or static discharge, which can damage the internal components.
  10. Testing:

    • Before deploying the device in a final application, perform thorough testing to ensure it meets all performance specifications and operates reliably under expected conditions.
(For reference only)

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