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Specifications
SKU: 7559865
Low-Side Gate Driver IC Inverting, Non-Inverting 6-SON-EP (3x3)
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 4.5 | - | 18 | V | - |
| Quiescent Current | IQ | - | 30 | - | μA | VCC = 12V, TA = 25°C |
| Input High Voltage | VIH | 2 | - | 18 | V | - |
| Input Low Voltage | VIL | - | - | 0.8 | V | - |
| Output High Voltage | VOH | 90 | - | 100 | % VCC | IOL = -1 A, VCC = 12V, TA = 25°C |
| Output Low Voltage | VOL | 0.2 | - | 0.4 | V | IOL = 1 A, VCC = 12V, TA = 25°C |
| Propagation Delay (Low to High) | tdLH | 15 | - | 25 | ns | VCC = 12V, TA = 25°C, CL = 100 pF |
| Propagation Delay (High to Low) | tdHL | 15 | - | 25 | ns | VCC = 12V, TA = 25°C, CL = 100 pF |
| Rise Time | tr | 5 | - | 10 | ns | VCC = 12V, TA = 25°C, CL = 100 pF |
| Fall Time | tf | 5 | - | 10 | ns | VCC = 12V, TA = 25°C, CL = 100 pF |
| Operating Temperature Range | TA | -40 | - | 125 | °C | - |
| Storage Temperature Range | TSTG | -65 | - | 150 | °C | - |
Instructions for Use:
Supply Voltage (VCC):
- Ensure the supply voltage is within the range of 4.5V to 18V.
- Do not exceed the maximum supply voltage to avoid damaging the device.
Input Voltage Levels:
- The input high voltage (VIH) should be at least 2V and can go up to the supply voltage.
- The input low voltage (VIL) should be below 0.8V to ensure proper low-state operation.
Output Voltage Levels:
- When the output is high, it will be approximately 90% to 100% of the supply voltage.
- When the output is low, it will be between 0.2V and 0.4V.
Propagation Delays:
- The propagation delay from low to high (tdLH) and from high to low (tdHL) should be considered when designing timing-sensitive circuits.
Rise and Fall Times:
- The rise time (tr) and fall time (tf) are critical for ensuring fast switching and minimizing switching losses.
Operating and Storage Temperatures:
- The device is designed to operate within the temperature range of -40°C to 125°C.
- Store the device within the temperature range of -65°C to 150°C to ensure long-term reliability.
Handling and ESD Protection:
- Handle the device with care to avoid electrostatic discharge (ESD).
- Use appropriate ESD protection measures during handling and installation.
Mounting and PCB Layout:
- Ensure proper thermal management by providing adequate heat dissipation.
- Follow recommended PCB layout guidelines to minimize parasitic inductances and capacitances.
Testing and Validation:
- Perform thorough testing under various operating conditions to ensure the device meets the required performance specifications.
For detailed application notes and further information, refer to the datasheet provided by Texas Instruments.
(For reference only)Inquiry - UCC27516DRSR
