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TDF8530TH/N1

Specifications

SKU: 8640382

BUY TDF8530TH/N1 https://www.utsource.net/itm/p/8640382.html

Parameter Symbol Min Typical Max Unit
Supply Voltage VDD 2.7 - 5.5 V
Operating Temperature Toper -40 - 125 °C
Storage Temperature Tstg -65 - 150 °C
Output Current (Per Channel) IOUT - 350 - mA
Quiescent Current IQ - 1.2 - mA
Shutdown Current ISD - 0.1 - μA
Power Dissipation PD - 1.2 - W
Thermal Resistance (θJA) θJA - 95 - °C/W
Protection Features - - Overcurrent, Overtemperature, Short-Circuit - -

Instructions for Use

  1. Supply Voltage:

    • Ensure the supply voltage is within the range of 2.7V to 5.5V to avoid damage to the device.
  2. Operating and Storage Temperature:

    • The device can operate between -40°C and 125°C and can be stored between -65°C and 150°C.
  3. Output Current:

    • Each channel can provide up to 350mA of output current. Do not exceed this limit to prevent overheating and potential damage.
  4. Quiescent Current:

    • The typical quiescent current is 1.2mA. This is the current consumed by the device when it is active but not driving any load.
  5. Shutdown Current:

    • When the device is in shutdown mode, the typical current consumption is 0.1μA. Use the shutdown feature to minimize power consumption when the device is not in use.
  6. Power Dissipation:

    • The typical power dissipation is 1.2W. Ensure adequate heat sinking or cooling if the device is operating at high power levels to prevent overheating.
  7. Thermal Resistance:

    • The thermal resistance from junction to ambient (θJA) is typically 95°C/W. This value helps in calculating the temperature rise for given power dissipation conditions.
  8. Protection Features:

    • The device includes overcurrent, overtemperature, and short-circuit protection to ensure safe operation under fault conditions.

Layout and Handling

  • PCB Layout:
    • Place the device close to the power supply and ground planes to minimize noise and improve stability.
    • Use wide traces for power and ground connections to reduce resistance and inductance.
  • Handling:
    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard ESD (Electrostatic Discharge) precautions during assembly and testing.

Application Notes

  • Heat Management:
    • If the device is expected to operate near its maximum power dissipation, consider using a heatsink or forced air cooling.
  • Capacitor Selection:
    • Use low ESR (Equivalent Series Resistance) capacitors for bypassing and filtering to maintain stability and performance.
  • Signal Integrity:
    • Keep signal traces as short as possible to minimize parasitic inductance and capacitance, which can affect performance.

For more detailed information, refer to the datasheet provided by the manufacturer.

(For reference only)

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