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OP27GSZ-REEL SOP8

Specifications

SKU: 8663133

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Parameter Value
Component OP27GSZ-REEL
Package Type SOP8 (Small Outline Package)
Operating Temperature -40°C to +125°C
Supply Voltage Range 2.7V to 36V
Quiescent Current 1.5 mA (Typical at Vcc = 15V, TA = 25°C)
Input Offset Voltage ±25 μV (Maximum at TA = 25°C)
Bandwidth 9 Hz (Unity Gain Bandwidth)
Slew Rate 0.3 V/μs
Output Voltage Swing ±13V (Minimum at Vcc = ±15V, RL = 10kΩ)
Common Mode Rejection Ratio (CMRR) 120 dB (Minimum at TA = 25°C)
Power Supply Rejection Ratio (PSRR) 110 dB (Minimum at TA = 25°C)
Noise 0.1 μVp-p (0.1 Hz to 10 Hz)
Output Current ±20 mA (Short-Circuit Protection)
Storage Temperature -65°C to +150°C
Lead Finish SnPb (Tin-Lead)

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage is within the specified range (2.7V to 36V).
    • Use decoupling capacitors (0.1 μF and 10 μF) close to the power pins to reduce noise and stabilize the supply.
  2. Input Configuration:

    • Connect the non-inverting input (pin 3) and inverting input (pin 2) as required by your application.
    • For differential inputs, ensure the common mode voltage is within the operational range.
  3. Output Configuration:

    • The output (pin 1) can drive loads up to ±20 mA.
    • For optimal performance, use a load resistance of 10 kΩ or higher.
  4. Grounding:

    • Connect the ground pin (pin 4) to the system ground to ensure stable operation.
    • Use a low impedance path to ground to minimize noise.
  5. Thermal Management:

    • Ensure adequate heat dissipation if operating at high temperatures or under high power conditions.
    • Use a heatsink if necessary, especially in high-power applications.
  6. Handling Precautions:

    • Handle with care to avoid damage to the leads and package.
    • Follow ESD (Electrostatic Discharge) precautions to prevent damage to the device.
  7. Mounting:

    • Solder the device using standard reflow soldering techniques.
    • Ensure proper alignment and orientation during assembly to avoid shorts or open circuits.
  8. Testing:

    • After assembly, test the device under typical operating conditions to ensure it meets the required specifications.
    • Verify the output voltage swing and other parameters to confirm proper functionality.
(For reference only)

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