Instructions for Use:

1. Mounting:

   • Ensure that the mounting surface is clean and flat.
   • Use a thermal compound to enhance heat dissipation between the device and the heatsink.
   • Torque the mounting screw to the recommended value to avoid damage.

2. Electrical Connections:

   • Connect the anode and cathode terminals correctly to avoid reverse polarity, which can lead to device failure.
   • Use appropriate wire gauges to handle the rated current.

3. Thermal Management:

   • Ensure adequate cooling to keep the junction temperature within the specified range.
   • Consider forced air cooling or a larger heatsink for high-power applications.

4. Storage:

   • Store the device in a dry, cool place away from direct sunlight.
   • Handle with care to prevent mechanical damage.

5. Handling:

   • Use proper ESD protection when handling the device to prevent electrostatic discharge damage.
   • Avoid applying excessive force to the leads during soldering.

6. Soldering:

   • Preheat the device to reduce thermal shock.
   • Use a controlled temperature soldering iron and follow the recommended soldering profile.
   • Allow the device to cool naturally after soldering.