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UPD5740T6N-E2

Specifications

SKU: 8865416

BUY UPD5740T6N-E2 https://www.utsource.net/itm/p/8865416.html

Parameter Description Min Typ Max Unit
Supply Voltage (VCC) Operating supply voltage 4.5 - 5.5 V
Output Current (IOL) Output low-level current - 10 - mA
Output Current (IOH) Output high-level current - -2 - mA
Input Voltage (VIH) High-level input voltage 2.0 - 5.5 V
Input Voltage (VIL) Low-level input voltage 0.0 - 0.8 V
Propagation Delay Time (tPD) Propagation delay time 10 - 30 ns
Power Dissipation (PD) Maximum power dissipation - - 100 mW
Operating Temperature (TA) Ambient operating temperature -40 - 85 °C
Storage Temperature (TSTG) Storage temperature range -65 - 150 °C

Instructions for Using UPD5740T6N-E2

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 4.5V to 5.5V.
    • Use a stable power source to avoid voltage fluctuations.
  2. Input Signals:

    • For high-level inputs (VIH), ensure the voltage is between 2.0V and 5.5V.
    • For low-level inputs (VIL), ensure the voltage is between 0.0V and 0.8V.
  3. Output Signals:

    • When driving loads, ensure the output low-level current (IOL) does not exceed 10mA.
    • Ensure the output high-level current (IOH) does not exceed -2mA.
  4. Propagation Delay:

    • The propagation delay time (tPD) should be considered when designing circuits to ensure proper timing.
  5. Thermal Management:

    • Keep the ambient operating temperature (TA) between -40°C and 85°C.
    • Store the device in temperatures ranging from -65°C to 150°C.
  6. Power Dissipation:

    • Do not exceed the maximum power dissipation (PD) of 100mW to prevent overheating and potential damage.
  7. Handling:

    • Handle the device with care to avoid static discharge and physical damage.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
  8. Mounting:

    • Ensure proper soldering and mounting techniques to avoid mechanical stress on the device.
    • Verify that the device is correctly aligned and securely attached to the PCB.
  9. Testing:

    • Perform initial testing under controlled conditions to verify functionality.
    • Monitor performance parameters regularly to ensure consistent operation.
(For reference only)

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