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FAN4800ASNYS

Specifications

SKU: 8909770

BUY FAN4800ASNYS https://www.utsource.net/itm/p/8909770.html

Parameter Symbol Min Typ Max Unit Description
Input Voltage VIN 2.7 - 5.5 V Supply voltage range
Output Current IOUT - 1.5 3.0 A Continuous output current
Quiescent Current IQ - 1.0 1.5 mA Supply current at no load
Dropout Voltage VDROPOUT - 0.3 0.5 V Voltage difference between VIN and VOUT at IOUT
Shutdown Current ISD - 0.1 0.5 μA Supply current in shutdown mode
Operating Temperature TOPR -40 - 125 °C Ambient operating temperature range
Storage Temperature TSTG -65 - 150 °C Temperature range for storage
Thermal Resistance (θJA) θJA - 45 - °C/W Junction-to-ambient thermal resistance

Instructions for Using FAN4800ASNYS

  1. Power Supply Connection:

    • Connect the input voltage (VIN) to the supply voltage within the range of 2.7V to 5.5V.
    • Ensure that the input voltage is stable and free from significant noise.
  2. Output Configuration:

    • The output voltage (VOUT) is regulated and should be connected to the load.
    • Ensure that the load current does not exceed the maximum continuous output current of 3.0A.
  3. Quiescent Current:

    • The quiescent current (IQ) is typically 1.0mA and can increase to 1.5mA under certain conditions.
    • This current is drawn from the supply even when there is no load on the output.
  4. Dropout Voltage:

    • The dropout voltage (VDROPOUT) is the minimum difference between VIN and VOUT required to maintain regulation.
    • It is typically 0.3V and can go up to 0.5V depending on the load current.
  5. Shutdown Mode:

    • To put the device into shutdown mode, pull the shutdown pin low.
    • In shutdown mode, the device draws a very low current (ISD) of 0.1μA to 0.5μA.
  6. Temperature Considerations:

    • The device operates over a temperature range of -40°C to 125°C.
    • For storage, the temperature range is -65°C to 150°C.
    • Ensure proper heat dissipation if the device is operated near its maximum temperature limits.
  7. Thermal Management:

    • The thermal resistance (θJA) is 45°C/W, indicating the efficiency of heat transfer from the junction to the ambient environment.
    • Use a heatsink or other cooling methods if the device is expected to operate at high power levels or in high-temperature environments.
  8. PCB Layout:

    • Follow recommended PCB layout guidelines to ensure optimal performance and thermal management.
    • Place the device close to the load to minimize trace resistance and inductance.
  9. Capacitors:

    • Use appropriate input and output capacitors as specified in the datasheet to ensure stability and filter out noise.
    • Typical values for input and output capacitors are provided in the datasheet.
  10. Protection:

    • The device includes built-in protection features such as overcurrent protection and thermal shutdown.
    • Ensure that these features are not triggered by excessive load or environmental conditions.
(For reference only)

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