Specifications
SKU: 8920388
Parameter | Symbol | Min | Typical | Max | Unit |
---|---|---|---|---|---|
Supply Voltage | Vcc | 4.5 | - | 5.5 | V |
Output Current (Continuous) | Iout | - | 300 | 500 | mA |
Quiescent Current | Iq | - | 1.0 | 1.5 | mA |
Dropout Voltage | Vdo | - | 0.5 | 1.0 | V |
Line Regulation | - | - | 0.01 | - | %/V |
Load Regulation | - | - | 0.05 | - | %/mA |
Thermal Shutdown | Tshut | - | 160 | - | °C |
Operating Temperature | Topr | -40 | - | 85 | °C |
Storage Temperature | Tstg | -55 | - | 150 | °C |
Instructions for BD41020FJC
Supply Voltage:
- Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V to avoid damage to the device.
Output Current:
- The device can provide a continuous output current of up to 500mA, with a typical value of 300mA. Ensure that the load does not exceed this limit to prevent overheating and potential failure.
Quiescent Current:
- The quiescent current (Iq) is typically 1.0mA and should not exceed 1.5mA. This is the current consumed by the device when no load is applied.
Dropout Voltage:
- The dropout voltage (Vdo) is the minimum difference between the input and output voltages required to maintain regulation. It is typically 0.5V and should not exceed 1.0V.
Line Regulation:
- The line regulation is 0.01% per volt, indicating the change in output voltage due to changes in input voltage.
Load Regulation:
- The load regulation is 0.05% per milliamp, indicating the change in output voltage due to changes in load current.
Thermal Shutdown:
- The device will shut down if the junction temperature reaches approximately 160°C to protect against thermal overload.
Operating Temperature:
- The operating temperature range is from -40°C to 85°C. Ensure the device operates within this range to avoid performance degradation or failure.
Storage Temperature:
- The storage temperature range is from -55°C to 150°C. Store the device in a dry, cool place to ensure long-term reliability.
Handling Precautions:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Use appropriate heat sinks or cooling solutions if the device is expected to operate at high power levels or in high-temperature environments.
Mounting:
- Ensure proper mounting and soldering techniques to avoid mechanical stress and ensure good thermal contact with any heat sinks used.
Testing:
- Before deploying the device in a final application, perform thorough testing under various conditions to ensure it meets the required specifications and performance criteria.
Inquiry - BD41020FJC