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BD41020FJC

Specifications

SKU: 8920388

BUY BD41020FJC https://www.utsource.net/itm/p/8920388.html

Parameter Symbol Min Typical Max Unit
Supply Voltage Vcc 4.5 - 5.5 V
Output Current (Continuous) Iout - 300 500 mA
Quiescent Current Iq - 1.0 1.5 mA
Dropout Voltage Vdo - 0.5 1.0 V
Line Regulation - - 0.01 - %/V
Load Regulation - - 0.05 - %/mA
Thermal Shutdown Tshut - 160 - °C
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -55 - 150 °C

Instructions for BD41020FJC

  1. Supply Voltage:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V to avoid damage to the device.
  2. Output Current:

    • The device can provide a continuous output current of up to 500mA, with a typical value of 300mA. Ensure that the load does not exceed this limit to prevent overheating and potential failure.
  3. Quiescent Current:

    • The quiescent current (Iq) is typically 1.0mA and should not exceed 1.5mA. This is the current consumed by the device when no load is applied.
  4. Dropout Voltage:

    • The dropout voltage (Vdo) is the minimum difference between the input and output voltages required to maintain regulation. It is typically 0.5V and should not exceed 1.0V.
  5. Line Regulation:

    • The line regulation is 0.01% per volt, indicating the change in output voltage due to changes in input voltage.
  6. Load Regulation:

    • The load regulation is 0.05% per milliamp, indicating the change in output voltage due to changes in load current.
  7. Thermal Shutdown:

    • The device will shut down if the junction temperature reaches approximately 160°C to protect against thermal overload.
  8. Operating Temperature:

    • The operating temperature range is from -40°C to 85°C. Ensure the device operates within this range to avoid performance degradation or failure.
  9. Storage Temperature:

    • The storage temperature range is from -55°C to 150°C. Store the device in a dry, cool place to ensure long-term reliability.
  10. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Use appropriate heat sinks or cooling solutions if the device is expected to operate at high power levels or in high-temperature environments.
  11. Mounting:

    • Ensure proper mounting and soldering techniques to avoid mechanical stress and ensure good thermal contact with any heat sinks used.
  12. Testing:

    • Before deploying the device in a final application, perform thorough testing under various conditions to ensure it meets the required specifications and performance criteria.
(For reference only)

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