Instructions for Use:

1. Voltage Ratings:

   • Ensure that the drain-source voltage (V_DS) does not exceed 500V.
   • The gate-source voltage (V_GS) should be kept between -15V and +20V to avoid damage.

2. Current Handling:

   • The continuous drain current (I_D) should not exceed 1.2A at an ambient temperature of 25°C.
   • For pulse applications, the pulse drain current (I_D(p)) can reach up to 3.6A for a pulse duration of 10 ms.

3. Power Dissipation:

   • The maximum power dissipation (P_D) is 1.4W at a case temperature of 25°C. Proper heat sinking may be required for higher power applications.

4. Temperature Management:

   • The junction temperature (T_J) should not exceed 150°C to ensure reliable operation.
   • The device can be stored within the temperature range of -55°C to 150°C.

5. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Follow proper soldering techniques to prevent thermal shock and mechanical stress during assembly.

6. Mounting:

   • Ensure good thermal contact between the device and the heatsink if used. Use thermal paste to enhance heat transfer.
   • Secure the device properly to prevent mechanical vibrations and stresses.

7. Testing:

   • Before final assembly, test the device under controlled conditions to ensure it meets the specified parameters.
   • Use appropriate test equipment and follow safety guidelines to avoid damage to the device or injury.