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TC74VHC221A

Specifications

SKU: 8940774

BUY TC74VHC221A https://www.utsource.net/itm/p/8940774.html
monostable multivibrator TC74VHC221A 16pin marking VHC221A
Parameter Symbol Min Typ Max Unit Notes
Supply Voltage VCC 2.0 - 5.5 V
Output Current (Source) IOH - 8 16 mA @ VCC = 5V, TA = 25°C
Output Current (Sink) IOL -32 -16 - mA @ VCC = 5V, TA = 25°C
Input Current IIH - 1 10 μA @ VCC = 5V, TA = 25°C
Low-Level Input Current IIL -1 - -0.1 μA @ VCC = 5V, TA = 25°C
Propagation Delay Time tpd 5 7 9 ns @ VCC = 5V, TA = 25°C
Power Dissipation PD - - 150 mW Per Package
Operating Temperature TOPR -40 - 85 °C
Storage Temperature TSTG -65 - 150 °C

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage (VCC) is within the range of 2.0V to 5.5V.
    • Do not exceed the maximum supply voltage to avoid damaging the device.
  2. Output Current:

    • The device can source up to 16mA and sink up to 32mA per output.
    • For reliable operation, keep the current within the typical values (8mA for sourcing, 16mA for sinking).
  3. Input Current:

    • The input current should be kept low to minimize power consumption.
    • Ensure that the input current does not exceed 10μA to maintain optimal performance.
  4. Propagation Delay:

    • The propagation delay time (tpd) is crucial for timing considerations in your circuit.
    • At a supply voltage of 5V and ambient temperature of 25°C, the typical propagation delay is 7ns.
  5. Power Dissipation:

    • The maximum power dissipation per package is 150mW.
    • Ensure proper heat dissipation if operating near this limit to prevent overheating.
  6. Operating and Storage Temperature:

    • The device can operate within a temperature range of -40°C to 85°C.
    • Store the device in an environment with temperatures between -65°C and 150°C.
  7. Handling:

    • Handle the device with care to avoid static damage.
    • Follow ESD (Electrostatic Discharge) precautions when handling the component.
  8. Mounting:

    • Ensure proper soldering and mounting techniques to avoid mechanical stress on the device.
    • Use appropriate PCB layout guidelines to ensure reliable operation.
(For reference only)

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