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Specifications
SKU: 8941827
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Maximum Drain-to-Source Voltage | VDS(max) | 600 | V |
| Maximum Gate-to-Source Voltage | VGS(max) | ±20 | V |
| Continuous Drain Current (TC = 25°C) | ID(25°C) | 75 | A |
| Continuous Drain Current (TC = 100°C) | ID(100°C) | 55 | A |
| Pulse Drain Current (TC = 25°C, 10 ms, 1% Duty Cycle) | IDpeak(25°C) | 225 | A |
| Power Dissipation (TC = 25°C) | PD(25°C) | 375 | W |
| Junction Temperature Range | TJ | -55 to +175 | °C |
| Storage Temperature Range | TSTG | -55 to +175 | °C |
| Total Device Dissipation (TA = 25°C) | PTOT(25°C) | 375 | W |
| Thermal Resistance, Junction to Case | RthJC | 0.5 | °C/W |
| Thermal Resistance, Junction to Ambient | RthJA | 40 | °C/W |
Instructions for Use:
Mounting and Handling:
- Ensure that the device is mounted on a heatsink with adequate thermal conductivity to maintain junction temperature within safe limits.
- Use proper handling techniques to avoid damage to the device, especially during soldering.
Electrical Connections:
- Connect the drain, source, and gate terminals correctly to avoid short circuits or incorrect biasing.
- Use short leads and wide traces to minimize inductance and resistance in the circuit.
Gate Drive:
- Apply a gate voltage (VGS) between 10V and 15V for optimal performance.
- Ensure that the gate drive circuit can provide sufficient current to charge and discharge the gate capacitance quickly.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it does not exceed 175°C.
- Use thermal paste or thermal interface materials to enhance heat transfer from the device to the heatsink.
Overcurrent Protection:
- Implement overcurrent protection to prevent damage due to excessive current.
- Consider using a current-limiting resistor or a fuse in series with the drain.
Storage and Transportation:
- Store the device in a dry, cool place away from direct sunlight.
- Handle the device with care to avoid mechanical stress or damage.
Testing:
- Before final assembly, test the device under controlled conditions to ensure it meets the specified parameters.
- Use appropriate test equipment and procedures to avoid damaging the device.
Compliance:
- Ensure that the device complies with all relevant safety and regulatory standards for your application.
Inquiry - FGW75N60HD
