Specifications
SKU: 8943741
Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Supply Voltage | VDD | 2.0 | - | 5.5 | V | Operating supply voltage range |
Input Voltage Range | VIN | 0 | - | VDD | V | Valid input voltage range |
Output Current | IOUT | - | 100 | 200 | mA | Maximum continuous output current |
Quiescent Current | IQ | - | 10 | 20 | μA | Supply current with no load |
Dropout Voltage | VDROPOUT | - | 200 | 300 | mV | Voltage difference between input and output when loaded |
Shutdown Current | ISD | - | 1 | 5 | μA | Current consumption in shutdown mode |
Thermal Shutdown | TSD | - | 150 | 170 | °C | Temperature at which the device shuts down |
Operating Temperature | TOPR | -40 | - | 125 | °C | Ambient temperature range for operation |
Storage Temperature | TSTG | -65 | - | 150 | °C | Temperature range for storage |
Instructions for Use:
Power Supply Connection:
- Connect the VDD pin to the positive terminal of your power supply.
- Connect the GND pin to the negative terminal (ground) of your power supply.
Input and Output Connections:
- Connect the input signal to the VIN pin.
- Connect the load or output circuit to the VOUT pin.
Capacitor Placement:
- Place a 100 nF ceramic capacitor between VDD and GND as close to the device as possible to ensure stable operation.
- Optionally, place a 1 μF ceramic capacitor between VOUT and GND to filter out noise and improve transient response.
Shutdown Control:
- To enable the device, apply a high logic level (VDD) to the SHDN pin.
- To disable the device and enter low-power shutdown mode, apply a low logic level (GND) to the SHDN pin.
Thermal Management:
- Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.
- Use a heatsink or thermal pad if necessary to maintain the device within its operating temperature range.
Handling Precautions:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Follow proper soldering techniques to prevent thermal stress and ensure reliable connections.
Storage and Handling:
- Store the device in a dry, cool environment within the specified storage temperature range.
- Use anti-static packaging when storing or transporting the device to prevent damage from electrostatic discharge.
Inquiry - LN9T26