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MP1471AGJ-Z SOT23-6

Specifications

SKU: 8944505

BUY MP1471AGJ-Z SOT23-6 https://www.utsource.net/itm/p/8944505.html

Parameter Symbol Test Conditions Min Typ Max Unit
Input Voltage VIN - 2.5 - 5.5 V
Output Voltage VOUT - 0.8 - 5.0 V
Output Current IOUT - - 1.5 2.0 A
Switching Frequency fSW - 1.0 1.2 1.5 MHz
Quiescent Current IQ VIN = 5V, VOUT = 3.3V - 30 60 μA
Shutdown Current ISD VIN = 5V, SHDN = 0V - 1 5 μA
Efficiency η VIN = 5V, VOUT = 3.3V - 92 - %
Thermal Shutdown Temperature TSD - - 160 - °C
Operating Junction Temperature TJ - -40 - 125 °C

Instructions for MP1471AGJ-Z SOT23-6

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 2.5V to 5.5V to avoid damage to the device.
  2. Output Voltage (VOUT):

    • Set the output voltage using external resistors according to the formula provided in the datasheet. The output voltage can be adjusted from 0.8V to 5.0V.
  3. Output Current (IOUT):

    • The typical output current is 1.5A, with a maximum of 2.0A. Ensure the load does not exceed this limit to prevent overheating or damage.
  4. Switching Frequency (fSW):

    • The switching frequency is typically 1.2MHz, which helps in reducing the size of external components like inductors and capacitors.
  5. Quiescent Current (IQ):

    • The quiescent current is typically 30μA at 5V input and 3.3V output. This low quiescent current helps in improving efficiency.
  6. Shutdown Current (ISD):

    • When the shutdown pin (SHDN) is pulled low (0V), the shutdown current is typically 1μA, allowing the device to enter a low-power mode.
  7. Efficiency (η):

    • The efficiency is typically 92% at 5V input and 3.3V output. This high efficiency is crucial for power management applications.
  8. Thermal Shutdown (TSD):

    • The device will automatically shut down if the junction temperature exceeds 160°C to prevent thermal damage.
  9. Operating Junction Temperature (TJ):

    • The operating junction temperature range is from -40°C to 125°C. Ensure the device operates within this range to maintain reliability.
  10. Layout Considerations:

    • Use short and wide traces for power connections to minimize parasitic inductance and resistance.
    • Place the input and output capacitors as close as possible to the IC to reduce noise and improve stability.
    • Ensure proper grounding and decoupling to maintain stable operation and minimize electromagnetic interference (EMI).
  11. Storage and Handling:

    • Store the device in a dry environment to prevent moisture damage.
    • Handle the device with care to avoid static discharge, which can damage the internal components.
  12. Application Notes:

    • Refer to the application notes provided in the datasheet for detailed information on designing circuits with the MP1471AGJ-Z, including component selection and layout guidelines.
(For reference only)

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