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IR2184STRPBF IRF2184S SOP-8

Specifications

SKU: 8944572

BUY IR2184STRPBF IRF2184S SOP-8 https://www.utsource.net/itm/p/8944572.html

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VDD 10 - 20 V -
Under Voltage Lockout (UVLO) Threshold VUVLO - 9.5 10.5 V -
Maximum Gate Charge QG - 33 45 nC VGS = 15V, IG = 1A
Maximum Input Capacitance Ciss - 1700 2300 pF VDD = 15V
Maximum Output Capacitance Coss - 260 350 pF VDD = 15V
Maximum Drain-Source Breakdown Voltage VBDS - - 600 V -
Maximum Continuous Drain Current ID - - 1.5 A TC = 25°C
Maximum Junction Temperature TJ(max) - - 150 °C -
Storage Temperature Range TSTG -40 - 150 °C -
Operating Temperature Range TA -40 - 125 °C -

Instructions for IR2184STRPBF (IRF2184S SOP-8)

  1. Power Supply Connection:

    • Connect VDD to the positive supply voltage (10V to 20V).
    • Connect VSS to ground.
  2. Gate Drive Signals:

    • Apply gate drive signals to the IN (input) pin.
    • The driver will output the appropriate high-side or low-side gate drive signals to the HO (high-side output) and LO (low-side output) pins.
  3. Bootstrap Capacitor:

    • For high-side operation, connect a bootstrap capacitor between the HO and VS (source) pins.
    • Ensure the bootstrap capacitor is rated for at least the maximum supply voltage and has low ESR (Equivalent Series Resistance).
  4. Under Voltage Lockout (UVLO):

    • The device will shut down if the supply voltage drops below the UVLO threshold (9.5V to 10.5V).
  5. Thermal Management:

    • Ensure adequate heat dissipation to keep the junction temperature within the specified range (up to 150°C).
    • Use a heatsink if necessary, especially under high current conditions.
  6. Storage and Handling:

    • Store the device in a dry environment within the temperature range of -40°C to 150°C.
    • Handle with care to avoid damage from electrostatic discharge (ESD).
  7. Package Information:

    • The IR2184STRPBF is packaged in an SOP-8 (Small Outline Package with 8 pins).
    • Ensure proper soldering and mounting techniques to avoid mechanical stress on the package.
  8. Safety and Compliance:

    • Follow all relevant safety standards and regulations when designing circuits that use this component.
    • Refer to the datasheet for detailed electrical and mechanical specifications.
(For reference only)

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