Instructions for Use:

1. Mounting:

   • Ensure proper heat sinking to maintain junction temperature within specified limits.
   • Use thermal compound between the device and heat sink for better thermal conductivity.

2. Biasing:

   • Apply gate-source voltage (V_GS) within the range of -20 V to +20 V.
   • For optimal performance, use a gate drive voltage of 10 V or higher to minimize R_DS(on).

3. Current Handling:

   • Do not exceed the continuous drain current (I_D) of 14 A at 25°C ambient temperature.
   • For pulsed applications, ensure that the peak current does not exceed 35 A.

4. Thermal Management:

   • Monitor the junction temperature (T_J) to avoid exceeding 150°C.
   • Use forced air cooling or a heatsink with adequate surface area for high-power applications.

5. Storage:

   • Store the device in a dry environment with temperatures between -55°C and 150°C.
   • Handle with care to avoid mechanical damage and static discharge.

6. Electrical Testing:

   • Use appropriate test equipment and procedures to avoid damaging the device.
   • Ensure all connections are secure and free from shorts or open circuits.

7. Soldering:

   • Follow recommended soldering profiles to prevent thermal shock.
   • Allow the device to cool down before testing to ensure reliability.

8. Safety:

   • Always follow safe handling practices when working with electrical components.
   • Use protective gear such as gloves and safety glasses when necessary.