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BD82032FVJ-GE2

Specifications

SKU: 8972211

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IC USB PWR SW HI SIDE 1CH 8TSSOP
Parameter Symbol Conditions Min Typ Max Unit
Input Voltage VIN - 1.6 - 5.5 V
Output Voltage VOUT - 1.2 - 3.3 V
Output Current IOUT - - 2.0 3.0 A
Quiescent Current IQ VOUT = 3.3V, IOUT = 0A - 30 70 μA
Dropout Voltage VDROP IOUT = 3.0A, VOUT = 3.3V - 300 500 mV
PSRR (Power Supply Rejection Ratio) PSRR f = 100Hz, IOUT = 3.0A - 70 - dB
Line Regulation ΔVOUT/ΔVIN IOUT = 3.0A, VIN = 2.5V to 5.5V - 0.5 - %
Load Regulation ΔVOUT/ΔIOUT VIN = 5.0V, IOUT = 0 to 3.0A - 0.5 - %
Thermal Shutdown TSD - - 150 - °C
Operating Temperature TOP - -40 - 125 °C

Instructions for Use:

  1. Input Voltage Range: Ensure the input voltage is within the specified range of 1.6V to 5.5V.
  2. Output Voltage Setting: The output voltage can be set between 1.2V and 3.3V using external resistors or by selecting a fixed output version.
  3. Output Current: The device is capable of providing up to 3.0A of output current with a typical value of 2.0A.
  4. Quiescent Current: The quiescent current should be kept as low as possible to minimize power consumption, typically around 30μA.
  5. Dropout Voltage: The dropout voltage is the difference between the input and output voltages at which the regulator can no longer maintain regulation. It is typically 300mV to 500mV at full load.
  6. PSRR (Power Supply Rejection Ratio): The PSRR indicates the ability of the regulator to reject ripple from the input voltage. At 100Hz, it is typically 70dB.
  7. Line Regulation: The change in output voltage due to changes in input voltage should not exceed 0.5%.
  8. Load Regulation: The change in output voltage due to changes in load current should not exceed 0.5%.
  9. Thermal Shutdown: The device will shut down if the temperature exceeds 150°C to prevent damage.
  10. Operating Temperature: The device is designed to operate over a wide temperature range from -40°C to 125°C.

Layout Considerations:

  • Place the input and output capacitors as close as possible to the device to minimize noise and improve stability.
  • Use a good thermal design to ensure the device operates within its temperature limits, especially under high load conditions.
  • Ensure the PCB layout minimizes parasitic inductance and resistance to optimize performance.
(For reference only)

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