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FGH40N60SFD ORIGINAL GOODS IN STOCK

Specifications

SKU: 8972307

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Parameter Description Value
Part Number Component Identifier FGH40N60SFD
Type Component Type MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor)
VDS (Max Drain-Source Voltage) Maximum Voltage that can be applied between Drain and Source 600V
VGS (Max Gate-Source Voltage) Maximum Voltage that can be applied between Gate and Source ±20V
ID (Continuous Drain Current) Continuous Current that can flow through the Drain 40A
RDS(on) (On-State Resistance) Resistance between Drain and Source when fully turned on 0.18Ω at VGS = 10V, T = 25°C
Power Dissipation (PD) Maximum Power that can be dissipated by the device 360W
Operating Temperature Range (TJ) Junction Temperature Range -55°C to +175°C
Storage Temperature Range (TSTG) Storage Temperature Range -65°C to +150°C
Package Type Physical Package of the Component TO-247
Lead Finish Surface Finish of the Leads Matte Tin

Instructions for Use:

  1. Handling Precautions:

    • ESD Protection: The FGH40N60SFD is sensitive to electrostatic discharge (ESD). Always use proper ESD protection when handling the device.
    • Thermal Management: Ensure adequate heat sinking to manage the power dissipation, especially when operating at high currents or temperatures.
  2. Mounting:

    • Torque Specifications: Follow the recommended torque specifications for the TO-247 package to avoid damaging the component.
    • Heat Sink Installation: Attach a suitable heat sink to the component to maintain the junction temperature within the specified range.
  3. Circuit Design:

    • Gate Drive: Use appropriate gate drive circuits to ensure the MOSFET turns on and off efficiently. Avoid excessive gate-source voltage to prevent damage.
    • Snubber Circuits: Consider using snubber circuits to protect against voltage spikes during switching operations.
  4. Storage:

    • Environmental Conditions: Store the component in a dry, cool environment within the specified storage temperature range.
    • Packaging: Keep the component in its original packaging until ready for use to protect it from moisture and physical damage.
  5. Testing:

    • Initial Testing: Before integrating the component into a circuit, perform initial testing to verify its functionality and parameters.
    • Regular Inspections: Conduct regular inspections and maintenance to ensure the component remains in good condition.

For detailed technical information and application notes, refer to the datasheet provided by the manufacturer.

(For reference only)

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