Name: IRFP350 16A400V IRFP350PBF TO247
Availability: InStock

IRFP350 16A400V IRFP350PBF TO247

Category: Transistors, Bipolar transistors

Specifications

SKU: 8975882

BUY IRFP350 16A400V IRFP350PBF TO247 https://www.utsource.net/itm/p/8975882.html

Parameter	Symbol	Min	Typical	Max	Unit	Condition
Drain-Source Voltage	V_DSS	-	400	-	V	@ I_D = 0, T_J = 25°C
Gate-Source Voltage	V_GSS	-20	-	20	V	@ I_G = ±1 mA, T_A = 25°C
Continuous Drain Current	I_D	-	16	-	A	@ V_DS = 400 V, T_C = 25°C
Pulse Drain Current	I_D(p)	-	48	-	A	@ V_DS = 400 V, t_p = 10 ms, T_C = 25°C
Gate Charge	Q_G	-	190	-	nC	@ V_GS = 15 V, I_D = 16 A
Input Capacitance	C_iss	-	2200	-	pF	@ V_DS = 400 V, f = 1 MHz
Output Capacitance	C_oss	-	1200	-	pF	@ V_DS = 400 V, f = 1 MHz
Reverse Transfer Capacitance	C_rss	-	750	-	pF	@ V_DS = 400 V, f = 1 MHz
Total Gate Charge	Q_GT	-	250	-	nC	@ V_GS = 15 V, I_D = 16 A
Turn-On Time	t_on	-	1.5	-	μs	@ V_GS = 15 V, I_D = 16 A, R_G = 10 Ω
Turn-Off Time	t_off	-	2.5	-	μs	@ V_GS = -15 V, I_D = 16 A, R_G = 10 Ω
Power Dissipation	P_tot	-	-	240	W	@ T_C = 25°C
Junction Temperature	T_J	-	-	175	°C	-
Storage Temperature	T_STG	-55	-	150	°C	-

Handling Precautions:
- Avoid static discharge by using proper grounding and ESD protection.
- Do not exceed the maximum ratings specified to prevent damage to the device.
Mounting:
- Ensure good thermal management by using a heatsink with adequate surface area and thermal paste.
- Torque the mounting screws to the recommended specifications to ensure proper thermal contact.
Biasing:
- Apply the gate voltage (V_GS) carefully to avoid exceeding the maximum gate-source voltage (V_GSS).
- Use a gate resistor (R_G) to control the turn-on and turn-off times and reduce switching losses.
Operating Conditions:
- Monitor the junction temperature (T_J) to ensure it remains within safe limits.
- Use appropriate cooling methods to maintain the device within its operating temperature range.
Testing:
- Perform initial testing at reduced power levels to verify proper operation.
- Use a current-limiting resistor during testing to protect the device from overcurrent conditions.
Storage:
- Store the device in a dry, cool environment to prevent moisture damage.
- Keep the device in its original packaging until ready for use to minimize exposure to static electricity.

(For reference only)

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