Instructions for Use

1. Circuit Connection:

   • Input (VIN): Connect the input voltage to the VIN pin.
   • Output (VOUT): Connect the output voltage to the VOUT pin.
   • Ground (GND): Connect the ground to the GND pin.

2. Heat Dissipation:

   • Ensure adequate heat dissipation by mounting the device on a heatsink if operating near maximum load conditions.
   • The thermal resistance (θja) should be considered to prevent overheating.

3. Input Filtering:

   • Place a 10μF electrolytic capacitor close to the input pins to filter out noise and ensure stable operation.

4. Output Filtering:

   • Place a 10μF electrolytic capacitor close to the output pins to smooth the output voltage and reduce ripple.

5. Overcurrent and Overtemperature Protection:

   • The device has built-in overcurrent and overtemperature protection. However, it is recommended to design the circuit with additional external protection components for critical applications.

6. Storage and Handling:

   • Store the device in a dry, cool place within the specified storage temperature range.
   • Handle the device with care to avoid mechanical damage or static discharge.

7. Soldering:

   • Use a soldering iron with a temperature not exceeding 300°C.
   • Avoid applying excessive heat for extended periods to prevent damage to the device.

8. Testing:

   • After assembly, test the circuit under no-load conditions to ensure proper operation before applying the full load.

9. Compliance:

   • Ensure that the device is used in compliance with all relevant safety and regulatory standards.