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SN74LS688DWR2

Specifications

SKU: 8978447

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Parameter Description Value
Part Number Part number of the device SN74LS688DWR2
Function 8-Bit Identity Comparator with Three-State Outputs
Supply Voltage (VCC) Operating supply voltage 4.75 V to 5.25 V
Supply Current (ICC) Maximum supply current at VCC = 5 V, TA = 25°C 30 mA
Input Voltage (VIH) High-level input voltage 2.0 V to 5.25 V
Input Voltage (VIL) Low-level input voltage 0 V to 0.8 V
Output Voltage (VOH) High-level output voltage (IOL = -0.4 mA) 2.4 V to 5.25 V
Output Voltage (VOL) Low-level output voltage (IOH = 16 mA) 0 V to 0.5 V
Propagation Delay Time Typical propagation delay time from input to output (TA = 25°C) 18 ns
Operating Temperature Junction temperature range -55°C to 125°C
Storage Temperature Storage temperature range -65°C to 150°C
Package Type Package type DIP-20
Pin Count Number of pins 20

Instructions for Use

  1. Power Supply:

    • Connect VCC to +5 V and GND to ground.
    • Ensure that the power supply is stable and within the specified range (4.75 V to 5.25 V).
  2. Inputs:

    • Connect the A0-A7 inputs to the first set of 8-bit data.
    • Connect the B0-B7 inputs to the second set of 8-bit data.
    • The A0-A7 and B0-B7 inputs should be driven by logic levels (0 V or 5 V).
  3. Outputs:

    • The A=B output will be high (5 V) if the data on A0-A7 matches the data on B0-B7.
    • The A>B and A<B outputs will be high (5 V) if the data on A0-A7 is greater than or less than the data on B0-B7, respectively.
    • The three-state outputs can be enabled or disabled using the G (gate) input. When G is low, the outputs are in a high-impedance state.
  4. Three-State Control:

    • The G input controls the three-state outputs. When G is high, the outputs are active. When G is low, the outputs are in a high-impedance state.
  5. Temperature Considerations:

    • Ensure that the device operates within the specified temperature range (-55°C to 125°C).
    • Avoid exposing the device to temperatures outside the storage range (-65°C to 150°C).
  6. Handling:

    • Handle the device with care to avoid damage from electrostatic discharge (ESD).
    • Use appropriate ESD protection measures when handling and soldering the device.
  7. Mounting:

    • Ensure proper mounting and soldering to maintain electrical and mechanical integrity.
    • Follow standard PCB design and assembly guidelines for reliable operation.
(For reference only)

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