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TSF30L200C

Specifications

SKU: 8979687

BUY TSF30L200C https://www.utsource.net/itm/p/8979687.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD 2.7 - 5.5 V Operating voltage range
Supply Current (Active) IDD - 2.5 - mA Current consumption in active mode
Supply Current (Shutdown) ISD - 0.1 - μA Current consumption in shutdown mode
Output Type - - - - Open Drain Output configuration
Output Low Voltage VOL - 0.4 - V Output voltage when low
Output High Impedance ZOH - - - Ω Output impedance when high
Input Threshold Voltage VIH 2.0 - 5.5 V Input voltage for logic high
Input Threshold Voltage VIL 0.8 - 2.0 V Input voltage for logic low
Operating Temperature TOPR -40 - 85 °C Operating temperature range
Storage Temperature TSTG -65 - 150 °C Storage temperature range
Maximum Junction Temperature TJMAX - - 150 °C Maximum junction temperature
ESD Rating HBM - - 2000 V Human Body Model (HBM) ESD rating
Package Type - - - - SOT-23 Package type

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the range of 2.7V to 5.5V.
    • Connect the VDD pin to the positive supply and GND pin to the ground.
  2. Output Configuration:

    • The output is open drain, so an external pull-up resistor is required to define the high state.
    • Choose a pull-up resistor value based on the load and desired rise time.
  3. Input Signal:

    • Apply input signals within the specified threshold voltages (VIL and VIH).
    • Ensure the input signal is stable and noise-free to avoid false triggering.
  4. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 85°C.
    • Store the device within the temperature range of -65°C to 150°C.
  5. ESD Protection:

    • Handle the device with care to avoid damage from electrostatic discharge.
    • Use proper ESD protection measures during handling and assembly.
  6. Shutdown Mode:

    • To enter shutdown mode, set the enable pin to a low state.
    • In shutdown mode, the current consumption drops to approximately 0.1 μA.
  7. Mounting and Handling:

    • Follow standard surface mount technology (SMT) guidelines for mounting the SOT-23 package.
    • Avoid excessive thermal stress during soldering.
  8. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure proper functionality.
    • Verify the output behavior with and without the pull-up resistor.
(For reference only)

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