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MN864718

Specifications

SKU: 8980255

BUY MN864718 https://www.utsource.net/itm/p/8980255.html

Parameter Symbol Min Typ Max Unit
Supply Voltage VDD 2.0 3.3 5.5 V
Operating Temperature Toper -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Output Current (Per Pin) Iout - 20 50 mA
Input Leakage Current Iin - 1 5 μA
Output Low Voltage VOL 0 0.4 0.9 V
Output High Voltage VOH 2.4 3.3 5.0 V
Propagation Delay Time tpd 5 10 20 ns
Power Dissipation PD - - 500 mW

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage is within the range of 2.0V to 5.5V to avoid damage to the device.
  2. Operating Temperature:

    • The device is designed to operate within the temperature range of -40°C to 85°C. Avoid exposing the device to temperatures outside this range during operation.
  3. Storage Temperature:

    • Store the device in an environment where the temperature ranges from -65°C to 150°C to prevent degradation.
  4. Output Current:

    • Each output pin can source or sink up to 50mA, with a typical current of 20mA. Ensure that the load does not exceed these limits to avoid overheating or damage.
  5. Input Leakage Current:

    • The input leakage current is typically 1μA and can be as high as 5μA. Design your circuit to account for this leakage to maintain accuracy.
  6. Output Voltage Levels:

    • When the output is low, the voltage will be between 0V and 0.9V.
    • When the output is high, the voltage will be between 2.4V and 5.0V, depending on the supply voltage.
  7. Propagation Delay Time:

    • The propagation delay time is the time it takes for the output to change state after the input changes. It typically ranges from 5ns to 20ns.
  8. Power Dissipation:

    • The maximum power dissipation is 500mW. Ensure proper heat dissipation if the device is operating near this limit to prevent thermal damage.
  9. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components. Use appropriate ESD protection measures.
  10. Mounting:

    • Follow recommended PCB layout guidelines to ensure optimal performance and reliability. Ensure good thermal management by providing adequate copper area for heat dissipation.
  11. Testing:

    • Before deploying the device in a final application, perform thorough testing under various conditions to ensure it meets the required specifications and performance criteria.
(For reference only)

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