Specifications
SKU: 8980255
Parameter | Symbol | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage | VDD | 2.0 | 3.3 | 5.5 | V |
Operating Temperature | Toper | -40 | - | 85 | °C |
Storage Temperature | Tstg | -65 | - | 150 | °C |
Output Current (Per Pin) | Iout | - | 20 | 50 | mA |
Input Leakage Current | Iin | - | 1 | 5 | μA |
Output Low Voltage | VOL | 0 | 0.4 | 0.9 | V |
Output High Voltage | VOH | 2.4 | 3.3 | 5.0 | V |
Propagation Delay Time | tpd | 5 | 10 | 20 | ns |
Power Dissipation | PD | - | - | 500 | mW |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage is within the range of 2.0V to 5.5V to avoid damage to the device.
Operating Temperature:
- The device is designed to operate within the temperature range of -40°C to 85°C. Avoid exposing the device to temperatures outside this range during operation.
Storage Temperature:
- Store the device in an environment where the temperature ranges from -65°C to 150°C to prevent degradation.
Output Current:
- Each output pin can source or sink up to 50mA, with a typical current of 20mA. Ensure that the load does not exceed these limits to avoid overheating or damage.
Input Leakage Current:
- The input leakage current is typically 1μA and can be as high as 5μA. Design your circuit to account for this leakage to maintain accuracy.
Output Voltage Levels:
- When the output is low, the voltage will be between 0V and 0.9V.
- When the output is high, the voltage will be between 2.4V and 5.0V, depending on the supply voltage.
Propagation Delay Time:
- The propagation delay time is the time it takes for the output to change state after the input changes. It typically ranges from 5ns to 20ns.
Power Dissipation:
- The maximum power dissipation is 500mW. Ensure proper heat dissipation if the device is operating near this limit to prevent thermal damage.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components. Use appropriate ESD protection measures.
Mounting:
- Follow recommended PCB layout guidelines to ensure optimal performance and reliability. Ensure good thermal management by providing adequate copper area for heat dissipation.
Testing:
- Before deploying the device in a final application, perform thorough testing under various conditions to ensure it meets the required specifications and performance criteria.
Inquiry - MN864718