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CD1376C

Specifications

SKU: 8980978

BUY CD1376C https://www.utsource.net/itm/p/8980978.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc Operating 4.5 5.0 5.5 V
Supply Current Icc Operating, No Load - 10 20 mA
Output Voltage (High) VOH IO = -100 μA 4.5 4.8 5.0 V
Output Voltage (Low) VOL IO = 100 μA 0.0 0.2 0.4 V
Input Voltage (High) VIH - 2.0 3.5 5.0 V
Input Voltage (Low) VIL - 0.0 1.5 2.0 V
Propagation Delay Time (Positive Edge) tpd(HL) Vcc = 5V, CL = 15pF 10 15 20 ns
Propagation Delay Time (Negative Edge) tpd(LH) Vcc = 5V, CL = 15pF 10 15 20 ns
Power Dissipation PD - - - 100 mW
Operating Temperature Range Topr - -40 25 85 °C
Storage Temperature Range Tstg - -65 - 150 °C

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage or malfunction.
  2. Supply Current:

    • The typical supply current is 10mA, but it can go up to 20mA under operating conditions.
  3. Output Voltage:

    • For high output, ensure the voltage is at least 4.5V when sourcing 100 μA.
    • For low output, ensure the voltage is no more than 0.4V when sinking 100 μA.
  4. Input Voltage:

    • For a high input, the voltage should be between 2.0V and 5.0V.
    • For a low input, the voltage should be between 0.0V and 2.0V.
  5. Propagation Delay:

    • The propagation delay time for both positive and negative edges should be within 10 to 20 nanoseconds when the load capacitance is 15pF and the supply voltage is 5V.
  6. Power Dissipation:

    • The maximum power dissipation should not exceed 100mW to prevent overheating.
  7. Operating and Storage Temperature:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -65°C to 150°C.
  8. Handling:

    • Handle the CD1376C with care to avoid static discharge, which can damage the component.
    • Use appropriate ESD protection measures during handling and installation.
  9. Mounting:

    • Ensure proper mounting to maintain good thermal and electrical connections.
    • Follow the recommended PCB layout guidelines to minimize noise and interference.
  10. Testing:

    • Test the component under the specified operating conditions to ensure it meets the performance specifications.
(For reference only)

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