Instructions for Use:

1. Mounting:

   • Ensure that the device is mounted on a PCB with proper thermal management to handle the maximum forward current.
   • Use the LL-34 package footprint for correct placement.

2. Electrical Connections:

   • Connect the anode and cathode terminals correctly to avoid reverse bias damage.
   • Ensure that the reverse voltage does not exceed 20V to prevent breakdown.

3. Thermal Management:

   • The device can dissipate up to 1.0W at room temperature. For higher power applications, ensure adequate heat sinking.
   • Monitor the operating temperature to keep it within the specified range (-55°C to 150°C).

4. Surge Protection:

   • The device can handle peak forward surge currents up to 20A for short durations. Ensure that these surges are within the specified limits to avoid damage.

5. Storage:

   • Store the device in a dry, cool place within the storage temperature range (-65°C to 175°C).
   • Avoid exposure to high humidity and corrosive environments.

6. Handling:

   • Handle the device with care to avoid mechanical stress or damage to the leads.
   • Use appropriate ESD protection measures to prevent electrostatic discharge damage.

7. Testing:

   • Test the device using the specified parameters to ensure it meets the required performance criteria.
   • Use a suitable test setup to measure forward voltage, reverse leakage current, and other relevant parameters.