Instructions for Use:

1. Mounting:

   • Ensure the component is mounted on a flat, clean surface.
   • Use appropriate soldering techniques to avoid overheating (maximum soldering temperature: 260°C for 10 seconds).

2. Electrical Connections:

   • Connect the forward voltage (V_F) across the diode with the correct polarity.
   • Do not exceed the maximum continuous forward current (I_F) or peak forward current (I_FM) ratings.

3. Thermal Management:

   • Operate within the specified operating temperature range (-40°C to 85°C).
   • Ensure adequate heat dissipation if the component is used near its maximum power dissipation (P_T).

4. Storage:

   • Store the component in a dry, cool place within the storage temperature range (-40°C to 100°C).

5. Handling:

   • Handle the component with care to avoid mechanical damage.
   • Use anti-static precautions to prevent electrostatic discharge (ESD) damage.

6. Testing:

   • Test the component using a multimeter or other appropriate testing equipment to ensure it meets the specified parameters.
   • Verify the reverse breakdown voltage (V_R) and forward voltage (V_F) during initial testing.