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MBR20200CFH

Specifications

SKU: 8995950

BUY MBR20200CFH https://www.utsource.net/itm/p/8995950.html

Parameter Symbol Min Typical Max Unit
Average Rectified Current IF(AV) - 20 - A
Peak Repetitive Reverse Voltage VRRM - 200 - V
Maximum RMS Voltage VRMS - 141 - V
Non-repetitive Surge Current (8.3/20μs) IFSM - 300 - A
Junction Temperature TJ -55 - 175 °C
Storage Temperature TSTG -65 - 150 °C
Operating Temperature TOPR -55 - 150 °C
Thermal Resistance, Junction to Case RθJC - 2.0 - °C/W
Forward Voltage Drop at IF = 1A VF - 0.95 - V
Reverse Leakage Current at VR = 150V, TJ = 25°C IR - 10 - μA

Instructions for Using MBR20200CFH:

  1. Handling Precautions:

    • ESD Protection: Handle the device with ESD-protected equipment to avoid damage.
    • Temperature Management: Ensure that the junction temperature does not exceed 175°C during operation.
    • Storage Conditions: Store the device in a dry environment within the temperature range of -65°C to 150°C.
  2. Mounting and Soldering:

    • Soldering Temperature: Use a soldering iron with a maximum temperature of 260°C for no more than 10 seconds.
    • Thermal Shock: Avoid subjecting the device to rapid temperature changes to prevent thermal shock.
  3. Electrical Connections:

    • Polarity: Ensure correct polarity when connecting the diode to the circuit. The cathode is marked on the device.
    • Current Limiting: Use appropriate current-limiting resistors or other components to ensure the average rectified current does not exceed 20A.
  4. Surge Current Handling:

    • Non-Repetitive Surge Current: The device can handle a non-repetitive surge current of up to 300A for a pulse width of 8.3/20μs. Ensure that the surge current does not exceed this limit to avoid damage.
  5. Thermal Management:

    • Heat Sinking: For high-power applications, use a heat sink to dissipate heat effectively and maintain the junction temperature within safe limits.
    • Thermal Resistance: The thermal resistance from the junction to the case is 2.0°C/W. Design the heat sink accordingly to manage the thermal load.
  6. Testing and Verification:

    • Forward Voltage Drop: Measure the forward voltage drop (VF) at a current of 1A to ensure it is within the specified range of 0.95V.
    • Reverse Leakage Current: Verify the reverse leakage current (IR) at a reverse voltage of 150V and a junction temperature of 25°C to ensure it does not exceed 10μA.
  7. Compliance and Standards:

    • RoHS Compliance: Ensure that the device complies with RoHS (Restriction of Hazardous Substances) standards if required for your application.
    • Safety Standards: Adhere to relevant safety standards and regulations for the specific application of the diode.

By following these guidelines, you can ensure the reliable and efficient operation of the MBR20200CFH diode in your electronic circuits.

(For reference only)

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