Specifications
SKU: 9237372
Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
---|---|---|---|---|---|---|
Supply Voltage | VCC | 2.0 | - | 6.0 | V | - |
Input Low Voltage | VIL | - | - | 1.5 | V | VCC = 4.5V to 5.5V |
Input High Voltage | VIH | 3.5 | - | - | V | VCC = 4.5V to 5.5V |
Output Low Voltage | VOL | - | 0.1 | 0.4 | V | IOL = 8 mA, VCC = 4.5V to 5.5V |
Output High Voltage | VOH | 4.4 | - | - | V | IOH = -4 mA, VCC = 4.5V to 5.5V |
Input Leakage Current | IIL | - | - | 1.0 | μA | VCC = 4.5V to 5.5V |
Output Leakage Current | IOL | - | - | 1.0 | μA | VCC = 4.5V to 5.5V |
Output Drive Current | IOH | -4 | - | - | mA | VOH = 2.4V, VCC = 4.5V to 5.5V |
Propagation Delay Time | tpd | - | 8 | - | ns | VCC = 5V, fo = 10 MHz |
Power Dissipation | PTOT | - | - | 150 | mW | Ta = 25°C |
Operating Temperature | TOP | -40 | - | 85 | °C | - |
Storage Temperature | TSTG | -65 | - | 150 | °C | - |
Instructions for Using 74HC245D NXP SOP20:
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V.
- Connect VCC to the positive power supply and GND to the ground.
Input Signals:
- Input signals should be within the specified input voltage levels (VIL and VIH).
- Avoid applying voltages outside the VCC range to any input pin.
Output Signals:
- The output pins will drive loads based on the specified output voltage and current capabilities.
- Ensure that the load does not exceed the maximum output current ratings.
Direction Control:
- Use the direction control pin (DIR) to set the direction of data transfer.
- When DIR is high, data is transmitted from A to B.
- When DIR is low, data is transmitted from B to A.
Enable/Disable:
- Use the output enable pin (OE) to control the state of the outputs.
- When OE is high, the outputs are in a high-impedance state.
- When OE is low, the outputs are active.
Propagation Delay:
- Consider the propagation delay time (tpd) when designing your circuit to ensure proper timing.
Thermal Management:
- Ensure adequate heat dissipation if operating at high power levels or in high ambient temperatures.
- Do not exceed the maximum power dissipation (PTOT) to prevent damage to the device.
Storage and Handling:
- Store the device in a temperature-controlled environment within the specified storage temperature range.
- Handle with care to avoid static discharge and physical damage.
Soldering:
- Follow recommended soldering profiles to avoid thermal stress and ensure reliable connections.
Testing:
- Test the device under typical operating conditions to verify its functionality.
- Use appropriate test equipment and procedures to avoid damaging the device during testing.
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