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74HC245D NXP SOP20

Specifications

SKU: 9237372

BUY 74HC245D NXP SOP20 https://www.utsource.net/itm/p/9237372.html

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 2.0 - 6.0 V -
Input Low Voltage VIL - - 1.5 V VCC = 4.5V to 5.5V
Input High Voltage VIH 3.5 - - V VCC = 4.5V to 5.5V
Output Low Voltage VOL - 0.1 0.4 V IOL = 8 mA, VCC = 4.5V to 5.5V
Output High Voltage VOH 4.4 - - V IOH = -4 mA, VCC = 4.5V to 5.5V
Input Leakage Current IIL - - 1.0 μA VCC = 4.5V to 5.5V
Output Leakage Current IOL - - 1.0 μA VCC = 4.5V to 5.5V
Output Drive Current IOH -4 - - mA VOH = 2.4V, VCC = 4.5V to 5.5V
Propagation Delay Time tpd - 8 - ns VCC = 5V, fo = 10 MHz
Power Dissipation PTOT - - 150 mW Ta = 25°C
Operating Temperature TOP -40 - 85 °C -
Storage Temperature TSTG -65 - 150 °C -

Instructions for Using 74HC245D NXP SOP20:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V.
    • Connect VCC to the positive power supply and GND to the ground.
  2. Input Signals:

    • Input signals should be within the specified input voltage levels (VIL and VIH).
    • Avoid applying voltages outside the VCC range to any input pin.
  3. Output Signals:

    • The output pins will drive loads based on the specified output voltage and current capabilities.
    • Ensure that the load does not exceed the maximum output current ratings.
  4. Direction Control:

    • Use the direction control pin (DIR) to set the direction of data transfer.
    • When DIR is high, data is transmitted from A to B.
    • When DIR is low, data is transmitted from B to A.
  5. Enable/Disable:

    • Use the output enable pin (OE) to control the state of the outputs.
    • When OE is high, the outputs are in a high-impedance state.
    • When OE is low, the outputs are active.
  6. Propagation Delay:

    • Consider the propagation delay time (tpd) when designing your circuit to ensure proper timing.
  7. Thermal Management:

    • Ensure adequate heat dissipation if operating at high power levels or in high ambient temperatures.
    • Do not exceed the maximum power dissipation (PTOT) to prevent damage to the device.
  8. Storage and Handling:

    • Store the device in a temperature-controlled environment within the specified storage temperature range.
    • Handle with care to avoid static discharge and physical damage.
  9. Soldering:

    • Follow recommended soldering profiles to avoid thermal stress and ensure reliable connections.
  10. Testing:

    • Test the device under typical operating conditions to verify its functionality.
    • Use appropriate test equipment and procedures to avoid damaging the device during testing.
(For reference only)

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