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D40HC

Specifications

SKU: 9269201

BUY D40HC https://www.utsource.net/itm/p/9269201.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD 2.0 - 6.0 V Operating supply voltage
Input Low Voltage VIL - - 1.5 V Maximum input low voltage
Input High Voltage VIH 3.5 - - V Minimum input high voltage
Output Low Voltage VOL - 0.4 0.9 V Maximum output low voltage
Output High Voltage VOH 2.4 - VDD-0.5 V Minimum output high voltage
Propagation Delay Time (Typical) tpLH, tpHL - 18 - ns Propagation delay time
Power Dissipation PD - - 100 mW Maximum power dissipation per gate
Operating Temperature TA -40 - 85 °C Operating ambient temperature
Storage Temperature TSTG -65 - 150 °C Storage temperature range

Instructions for Using D40HC Series Devices

  1. Supply Voltage:

    • Ensure the supply voltage (VDD) is within the range of 2.0V to 6.0V to avoid damage to the device.
  2. Input Levels:

    • For a valid low input, the voltage should be less than or equal to 1.5V.
    • For a valid high input, the voltage should be greater than or equal to 3.5V.
  3. Output Levels:

    • The output low voltage (VOL) will not exceed 0.9V under typical conditions.
    • The output high voltage (VOH) will be at least 2.4V and can go up to VDD - 0.5V.
  4. Propagation Delay:

    • The typical propagation delay time (tpLH, tpHL) is 18 nanoseconds. This is the time it takes for the output to change state after the input changes.
  5. Power Dissipation:

    • Each gate in the D40HC series can dissipate up to 100 milliwatts of power. Ensure proper heat management if operating near this limit.
  6. Operating Temperature:

    • The device is designed to operate in ambient temperatures ranging from -40°C to 85°C. Ensure the environment does not exceed these limits.
  7. Storage Temperature:

    • When storing the device, keep it within the temperature range of -65°C to 150°C to prevent damage.
  8. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the sensitive components.
    • Use appropriate ESD protection measures when handling and installing the device.
  9. Mounting and Soldering:

    • Follow recommended soldering profiles and temperatures to ensure reliable connections and avoid thermal stress on the device.
    • Avoid excessive mechanical stress during mounting and handling.
  10. Testing and Verification:

    • After installation, verify the functionality of the device by checking the input and output levels and ensuring they meet the specified parameters.
(For reference only)

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