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ADUM1201ARZ-RL7 Z SOP8

Specifications

SKU: 9272534

BUY ADUM1201ARZ-RL7 Z SOP8 https://www.utsource.net/itm/p/9272534.html

Parameter Description Min Typ Max Unit
Isolation Voltage Minimum isolation voltage between input and output - 2500 - Vrms
Working Voltage Maximum continuous working voltage between input and output - 560 - Vdc
Insulation Withstand Voltage Minimum insulation withstand voltage for 1 second - 3750 - Vpk
Input Voltage (VIH) High-level input voltage 2.0 - 5.5 V
Input Voltage (VIL) Low-level input voltage 0 - 0.8 V
Output Voltage (VOH) High-level output voltage 2.4 - 5.5 V
Output Voltage (VOL) Low-level output voltage 0 - 0.4 V
Propagation Delay (tPD) Time delay from input to output 9 - 15 ns
Propagation Delay Skew (tPSK) Maximum difference in propagation delay between channels - - 5 ns
Common Mode Transient Immunity (CMTI) Ability to reject common mode transients - 25 - kV/μs
Operating Temperature Range of ambient operating temperatures -40 - 125 °C
Storage Temperature Range of storage temperatures -65 - 150 °C
Supply Current (ICC) Quiescent current per channel 1.0 - 1.5 mA
Channel-to-Channel Capacitance Capacitance between isolated channels - - 2.0 pF

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage is within the specified range (2.7V to 5.5V).
    • Connect the power supply to both the input and output sides if using dual power supplies.
  2. Signal Levels:

    • Input signals should be within the VIH and VIL specifications.
    • Output signals will be within the VOH and VOL specifications.
  3. Isolation:

    • Ensure that the working voltage does not exceed 560Vdc.
    • For safety, do not exceed the insulation withstand voltage of 3750Vpk for more than 1 second.
  4. Timing:

    • Account for the propagation delay (tPD) and skew (tPSK) in your system design to ensure proper timing.
  5. Environmental Conditions:

    • Operate the device within the specified temperature ranges to avoid damage or performance degradation.
  6. Handling:

    • Handle with care to avoid mechanical stress on the package.
    • Follow ESD (Electrostatic Discharge) precautions to prevent damage.
  7. Mounting:

    • Ensure proper soldering and mounting to avoid thermal issues and mechanical stress.
    • Use recommended PCB layout guidelines for optimal performance and reliability.
  8. Testing:

    • Perform functional tests to verify correct operation after assembly.
    • Test for CMTI and other electrical characteristics as needed.

For detailed application notes and further information, refer to the datasheet provided by Analog Devices.

(For reference only)

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