Instructions for Use:

1. Mounting:

   • Ensure the mounting surface is flat and clean.
   • Apply a suitable thermal interface material (TIM) to ensure good thermal contact.
   • Torque the mounting screws to the specified value to avoid over-tightening.

2. Electrical Connections:

   • Use appropriate wire gauges for the rated currents.
   • Ensure all connections are secure and free from corrosion.
   • Follow the recommended PCB layout guidelines to minimize parasitic inductances.

3. Thermal Management:

   • Ensure adequate cooling, such as forced air or liquid cooling, to maintain the case temperature within the specified range.
   • Monitor the temperature during operation to prevent overheating.

4. Gate Drive:

   • Use a gate drive circuit that provides the necessary gate-emitter voltage and current.
   • Ensure the gate drive circuit has appropriate rise and fall times to minimize switching losses.

5. Storage and Handling:

   • Store the module in a dry, cool place away from direct sunlight.
   • Handle with care to avoid mechanical damage.
   • Use proper ESD protection when handling the module to prevent damage to sensitive components.

6. Safety Precautions:

   • Always follow safety guidelines when working with high voltages and currents.
   • Ensure proper insulation and grounding to prevent electrical shock.
   • Regularly inspect the module and connections for signs of wear or damage.

7. Testing:

   • Perform initial testing at low power to verify correct operation.
   • Gradually increase power levels while monitoring performance parameters.

8. Documentation:

   • Refer to the datasheet and application notes for detailed technical information and specific application guidance.