Instructions for Use:

1. Power Supply Connection:

   • Connect the positive terminal of the power supply to the Vcc pin.
   • Connect the negative terminal (ground) to the GND pin.

2. Output Connection:

   • Connect the load to the OUT pin.
   • Ensure that the load does not exceed the maximum output current (1.5 A).

3. Capacitors:

   • Place a 10 μF tantalum capacitor between the OUT pin and GND to stabilize the output.
   • Optionally, place a 0.1 μF ceramic capacitor between the Vcc pin and GND for additional noise filtering.

4. Thermal Considerations:

   • Ensure adequate heat dissipation if operating near the maximum output current.
   • The device will automatically shut down if the junction temperature exceeds 160°C.

5. PCB Layout:

   • Keep the traces from Vcc to the IC and from the IC to the load as short as possible to minimize voltage drops and improve efficiency.
   • Use wide traces for high current paths to reduce resistance and heat generation.

6. Storage and Handling:

   • Store the device in a dry, cool environment within the specified storage temperature range (-65°C to 150°C).
   • Handle with care to avoid damage to the pins or the body of the IC.

7. Testing:

   • Before final assembly, test the device under typical operating conditions to ensure it meets the required specifications.
   • Verify the output voltage and current regulation using a multimeter and a variable load.