BUY CM603 https://www.utsource.net/itm/p/9380739.html

CM603 is a QFN (Quad Flat No-Lead) package from CMI (ChipMall International). It is a small-sized package with a low profile and high density. It is suitable for high-density mounting on a printed circuit board (PCB). The CM603 package is designed for applications such as power management, signal processing, and memory. It is suitable for use in consumer electronics, automotive, and industrial applications. It has a wide operating temperature range of -40°C to +125°C. It also has a high thermal resistance of 0.8°C/W. The package is RoHS compliant and is lead-free. (For reference only)