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DM74S188AN

Specifications

SKU: 9454606

BUY DM74S188AN https://www.utsource.net/itm/p/9454606.html

Parameter Symbol Min Typ Max Unit
Supply Voltage VCC 4.75 5.0 5.25 V
Output High Voltage (VOH) - - 2.4 - V @ IL=-0.4mA, VCC=5V
Output Low Voltage (VOL) - - 0.4 - V @ IL=16mA, VCC=5V
Input High Voltage (VIH) - 2.0 - - V
Input Low Voltage (VIL) - - 0.8 - V
Propagation Delay Time tpd - 35 - ns @ VCC=5V, TA=25°C
Power Dissipation PT - - 100 mW
Operating Temperature Range TA -40 - 85 °C
Storage Temperature Range TSTG -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 4.75V to 5.25V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Input Signals:

    • Apply input signals that meet the input high (VIH) and input low (VIL) voltage levels.
    • Avoid exceeding the maximum input voltage levels to prevent damage to the device.
  3. Output Signals:

    • The output high (VOH) and output low (VOL) voltages are designed to drive standard TTL loads.
    • Ensure the load current does not exceed the specified limits to avoid overheating or damage.
  4. Propagation Delay:

    • The typical propagation delay time (tpd) is 35 nanoseconds at room temperature (25°C) and a supply voltage of 5V.
    • Consider this delay when designing timing-sensitive circuits.
  5. Temperature Considerations:

    • Operate the device within the specified operating temperature range (-40°C to 85°C).
    • Store the device within the storage temperature range (-65°C to 150°C) to ensure long-term reliability.
  6. Power Dissipation:

    • Ensure the power dissipation (PT) does not exceed 100 milliwatts to avoid thermal issues.
    • Use appropriate heat sinking if necessary, especially in high-power applications.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow ESD (Electrostatic Discharge) precautions during handling and installation.
  8. Mounting:

    • Mount the device on a PCB using standard surface mount or through-hole techniques.
    • Ensure proper soldering and alignment to avoid mechanical stress on the pins.
  9. Testing:

    • Test the device under controlled conditions to verify its performance before integrating it into a larger system.
    • Use a multimeter or oscilloscope to check the input and output signals for correct operation.
(For reference only)

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