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HD6433644PV

Specifications

SKU: 9454667

BUY HD6433644PV https://www.utsource.net/itm/p/9454667.html

Parameter Symbol Min Typ Max Unit
Supply Voltage Vcc 4.5 5.0 5.5 V
Operating Temperature Ta -40 - 85 °C
Storage Temperature Tstg -55 - 150 °C
Maximum Junction Temperature Tjmax - - 150 °C
Input Voltage Range Vin 0 - Vcc V
Output Voltage Range Vout 0 - Vcc V
Input Current Iin - 10 20 μA
Output Current Iout 0 100 200 mA
Power Consumption Pd - 500 700 mW
Propagation Delay Time tpd 10 20 30 ns
Setup Time tsu 10 15 20 ns
Hold Time th 5 10 15 ns
Clock Frequency fCLK 0 20 40 MHz

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
    • Connect a stable power supply to avoid voltage fluctuations.
  2. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 85°C.
    • Store the device in an environment where temperatures do not exceed -55°C to 150°C.
  3. Input and Output Signals:

    • Input voltages should be within the range of 0V to Vcc.
    • Output voltages will also be within the range of 0V to Vcc.
    • Ensure input currents do not exceed 20μA and output currents do not exceed 200mA.
  4. Power Consumption:

    • The device has a typical power consumption of 500mW, with a maximum of 700mW.
  5. Timing Parameters:

    • Ensure that the propagation delay time (tpd) is between 10ns and 30ns.
    • Setup time (tsu) should be between 10ns and 20ns.
    • Hold time (th) should be between 5ns and 15ns.
  6. Clock Frequency:

    • The device supports clock frequencies from 0MHz to 40MHz.
  7. Handling and Storage:

    • Handle the device with care to avoid damage.
    • Store the device in a dry, cool place to prevent moisture damage.
  8. Electrostatic Discharge (ESD) Protection:

    • Use proper ESD protection measures when handling the device to prevent damage from static electricity.
  9. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure reliable connections.
    • Avoid excessive heat during soldering to prevent damage to the device.
  10. Testing:

    • Perform initial testing under controlled conditions to verify proper operation.
    • Regularly monitor performance parameters to ensure the device continues to function within specifications.
(For reference only)

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