Specifications
SKU: 9454667
Parameter | Symbol | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage | Vcc | 4.5 | 5.0 | 5.5 | V |
Operating Temperature | Ta | -40 | - | 85 | °C |
Storage Temperature | Tstg | -55 | - | 150 | °C |
Maximum Junction Temperature | Tjmax | - | - | 150 | °C |
Input Voltage Range | Vin | 0 | - | Vcc | V |
Output Voltage Range | Vout | 0 | - | Vcc | V |
Input Current | Iin | - | 10 | 20 | μA |
Output Current | Iout | 0 | 100 | 200 | mA |
Power Consumption | Pd | - | 500 | 700 | mW |
Propagation Delay Time | tpd | 10 | 20 | 30 | ns |
Setup Time | tsu | 10 | 15 | 20 | ns |
Hold Time | th | 5 | 10 | 15 | ns |
Clock Frequency | fCLK | 0 | 20 | 40 | MHz |
Instructions for Use
Power Supply:
- Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
- Connect a stable power supply to avoid voltage fluctuations.
Temperature Considerations:
- Operate the device within the temperature range of -40°C to 85°C.
- Store the device in an environment where temperatures do not exceed -55°C to 150°C.
Input and Output Signals:
- Input voltages should be within the range of 0V to Vcc.
- Output voltages will also be within the range of 0V to Vcc.
- Ensure input currents do not exceed 20μA and output currents do not exceed 200mA.
Power Consumption:
- The device has a typical power consumption of 500mW, with a maximum of 700mW.
Timing Parameters:
- Ensure that the propagation delay time (tpd) is between 10ns and 30ns.
- Setup time (tsu) should be between 10ns and 20ns.
- Hold time (th) should be between 5ns and 15ns.
Clock Frequency:
- The device supports clock frequencies from 0MHz to 40MHz.
Handling and Storage:
- Handle the device with care to avoid damage.
- Store the device in a dry, cool place to prevent moisture damage.
Electrostatic Discharge (ESD) Protection:
- Use proper ESD protection measures when handling the device to prevent damage from static electricity.
Mounting and Soldering:
- Follow recommended soldering profiles to ensure reliable connections.
- Avoid excessive heat during soldering to prevent damage to the device.
Testing:
- Perform initial testing under controlled conditions to verify proper operation.
- Regularly monitor performance parameters to ensure the device continues to function within specifications.
Inquiry - HD6433644PV