Specifications
SKU: 9459800
NEW
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage (VCC) | Operating supply voltage | 2.0 | - | 5.5 | V |
Output High-Level Voltage (VOH) | Output high-level voltage at IOH = -0.4 mA | - | 2.4 | VCC-0.1 | V |
Output Low-Level Voltage (VOL) | Output low-level voltage at IOL = 8 mA | - | - | 0.1 | V |
Input Low-Level Voltage (VIL) | Input low-level voltage | - | - | 0.8 | V |
Input High-Level Voltage (VIH) | Input high-level voltage | 2.0 | - | VCC | V |
Propagation Delay Time (tPD) | Propagation delay time from input to output | - | 6 | 13 | ns |
Power Dissipation (PD) | Maximum power dissipation | - | - | 730 | mW |
Operating Temperature (TA) | Ambient operating temperature range | -40 | - | 85 | °C |
Storage Temperature (TSTG) | Storage temperature range | -65 | - | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VCC) is within the specified range of 2.0V to 5.5V.
- Connect the ground (GND) pin to a stable reference point.
Input Signals:
- Input signals should be within the valid logic levels:
- Low level (VIL): 0V to 0.8V
- High level (VIH): 2.0V to VCC
- Input signals should be within the valid logic levels:
Output Signals:
- Output signals will be:
- High level (VOH): 2.4V to VCC-0.1V
- Low level (VOL): 0V to 0.1V
- Output signals will be:
Propagation Delay:
- The propagation delay time (tPD) is typically 6ns but can vary between 6ns and 13ns depending on conditions.
Power Dissipation:
- Ensure that the total power dissipation (PD) does not exceed 730mW to avoid overheating and potential damage.
Temperature Range:
- The device is designed to operate within an ambient temperature range of -40°C to 85°C.
- Store the device in an environment with temperatures ranging from -65°C to 150°C.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal circuits.
- Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.
Mounting:
- Ensure proper mounting and soldering techniques to avoid mechanical stress on the pins and the device itself.
Testing:
- Perform initial testing under controlled conditions to verify correct operation before integrating into a larger system.
Compliance:
- Ensure that the device complies with all relevant safety and regulatory standards for your application.
Inquiry - SN74LV574APWE4