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CD4066BNS

Specifications

SKU: 9460350

BUY CD4066BNS https://www.utsource.net/itm/p/9460350.html
LOGIC COUNTER/DIVIDER/REGISTER
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VDD - VSS Continuous Operation 3 15 V
Input Voltage VI Relative to VSS -0.5 VDD + 0.5 V
Output Voltage (ON) VON IOL = ±10 mA, VDD = 15 V 0.2 0.8 V
Leakage Current ILEAK VDD = 15 V, TA = 25°C -1 1 μA
Control Input Leakage IIL VDD = 15 V, TA = 25°C -1 1 μA
Control Input High Level VIH VDD = 15 V 7 15 V
Control Input Low Level VIL VDD = 15 V 0 3 V
Turn-On Time tON VDD = 15 V, RL = 1 kΩ, CL = 10 pF 5 15 ns
Turn-Off Time tOFF VDD = 15 V, RL = 1 kΩ, CL = 10 pF 5 15 ns
Operating Temperature TA Commercial Grade 0 70 °C
Storage Temperature TSTG -65 150 °C

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage (VDD - VSS) is within the range of 3 to 15 V for continuous operation.
  2. Input Voltage:

    • The input voltage should be within the range of -0.5 V to VDD + 0.5 V relative to VSS.
  3. Output Voltage (ON):

    • When the switch is ON, the output voltage should not exceed 0.8 V for a load current of ±10 mA at 15 V supply.
  4. Leakage Current:

    • The leakage current through the switches should be less than ±1 μA at 25°C and 15 V supply.
  5. Control Input Leakage:

    • The control input leakage current should be less than ±1 μA at 25°C and 15 V supply.
  6. Control Input Levels:

    • For the switch to turn ON, the control input voltage (VIH) should be between 7 V and 15 V.
    • For the switch to turn OFF, the control input voltage (VIL) should be between 0 V and 3 V.
  7. Switching Times:

    • The turn-on and turn-off times should be within 5 to 15 ns when using a 1 kΩ load resistor and 10 pF load capacitance at 15 V supply.
  8. Operating Temperature:

    • The device is designed to operate within a temperature range of 0°C to 70°C for commercial grade applications.
  9. Storage Temperature:

    • Store the device in a temperature range of -65°C to 150°C.
  10. Handling:

    • Handle the device with care to avoid static damage. Use proper ESD protection practices.
  11. Mounting:

    • Ensure proper mounting and soldering techniques to avoid thermal and mechanical stress on the device.
(For reference only)

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