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Specifications
SKU: 9477402
| Parameter | Symbol | Min | Typical | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | 4.75 | 5.0 | 5.25 | V | |
| Operating Temperature Range | -40 | 85 | °C | |||
| Storage Temperature Range | -65 | 150 | °C | |||
| Output High Voltage | VOH | 3.7 | 4.9 | 5.0 | V | @ IOL = -4mA, VCC = 5V |
| Output Low Voltage | VOL | 0.0 | 0.1 | 0.4 | V | @ IOH = 4mA, VCC = 5V |
| Input High Voltage | VIH | 3.5 | 5.0 | V | ||
| Input Low Voltage | VIL | 0.0 | 1.5 | V | ||
| Input Leakage Current | IIL | -1 | 0 | 1 | μA | |
| Output Leakage Current | IOL | -1 | 0 | 1 | μA | |
| Propagation Delay Time (Low to High) | tPLH | 10 | 15 | 25 | ns | @ VCC = 5V, TA = 25°C |
| Propagation Delay Time (High to Low) | tPHL | 10 | 15 | 25 | ns | @ VCC = 5V, TA = 25°C |
| Skew | tSK | 0 | 2 | 5 | ns | @ VCC = 5V, TA = 25°C |
| Power Dissipation | PD | 250 | mW | @ VCC = 5V, TA = 25°C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the specified range of 4.75V to 5.25V.
- Use a stable power source to avoid fluctuations that could affect performance.
Temperature Considerations:
- The device operates within an ambient temperature range of -40°C to 85°C.
- Store the device in temperatures ranging from -65°C to 150°C.
Input and Output Levels:
- Ensure input voltages (VIH and VIL) are within the specified ranges to prevent damage or incorrect operation.
- Check output voltages (VOH and VOL) to ensure they meet the required levels for your application.
Current Limits:
- Monitor input and output currents (IIL, IOL) to stay within the specified limits to avoid overheating or damage.
Timing Parameters:
- Verify propagation delay times (tPLH, tPHL) and skew (tSK) to ensure proper timing in your circuit design.
Power Dissipation:
- Ensure the power dissipation (PD) does not exceed the maximum rating to avoid thermal issues.
Handling and Storage:
- Handle the device with care to avoid static damage.
- Store in a dry, cool place to prevent moisture-related issues.
Mounting and Soldering:
- Follow recommended soldering profiles to avoid thermal stress during assembly.
- Ensure proper mechanical support and alignment during mounting.
Testing:
- Test the device under typical operating conditions to verify its functionality.
- Use appropriate test equipment and procedures to avoid damaging the device.
Documentation:
- Refer to the datasheet and application notes for detailed information and specific use cases.
Inquiry - SN65C1168ENSR 65C1168E SN65C1168NSR
