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X28C64JM-20

Specifications

SKU: 9517256

BUY X28C64JM-20 https://www.utsource.net/itm/p/9517256.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VCC 1.7 - 5.5 V Operating voltage range
Output Current (High) IOH - - 20 mA Maximum output current when output is high
Output Current (Low) IOL - - 20 mA Maximum output current when output is low
Input Current IIN - - 1 μA Maximum input current
Standby Current ISTBY - 1 5 μA Current consumption in standby mode
Active Current IACT - 50 100 μA Current consumption in active mode
Access Time tAA - 10 20 ns Time required for a valid read or write operation
Write Cycle Time tWC - 50 100 μs Minimum time between consecutive write operations
Data Retention Time tRET - - 10 years Guaranteed data retention at 25°C
Operating Temperature TOP -40 - 85 °C Temperature range for normal operation
Storage Temperature TSTG -55 - 125 °C Temperature range for storage

Instructions

  1. Power Supply:

    • Ensure that the supply voltage (VCC) is within the range of 1.7V to 5.5V.
    • Connect the VCC pin to the power source and GND pin to ground.
  2. Input and Output Handling:

    • Do not exceed the maximum input current (IIN) of 1 μA.
    • The maximum output current for both high (IOH) and low (IOL) states is 20 mA.
  3. Current Consumption:

    • In standby mode, the device consumes a maximum of 5 μA.
    • In active mode, the device consumes between 50 μA and 100 μA.
  4. Timing Parameters:

    • Ensure that the access time (tAA) is between 10 ns and 20 ns for valid read or write operations.
    • The write cycle time (tWC) should be at least 50 μs to ensure reliable data writing.
  5. Data Retention:

    • The device guarantees data retention for up to 10 years at 25°C.
  6. Temperature Considerations:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -55°C to 125°C.
  7. Handling and Storage:

    • Handle the device with care to avoid electrostatic discharge (ESD).
    • Store the device in a dry and cool environment within the specified storage temperature range.
  8. Mounting and Soldering:

    • Follow recommended soldering profiles to avoid thermal stress on the device.
    • Use appropriate tools and techniques to mount the device on the PCB.
(For reference only)

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