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SQD2011K D2011K

Specifications

SKU: 9767799

BUY SQD2011K D2011K https://www.utsource.net/itm/p/9767799.html

Parameter Symbol Min Typ Max Unit
Supply Voltage Vcc 4.5 5.0 5.5 V
Output Current Iout - 20 50 mA
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Output Impedance Rout - 100 - Ω
Response Time Tr - 1 - μs
Power Dissipation Pd - 100 - mW
Input Capacitance Cin - 10 - pF
Output Capacitance Cout - 5 - pF

Instructions for Using SQD2011K D2011K

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
  2. Output Current (Iout):

    • The typical output current is 20mA, with a maximum of 50mA. Do not exceed the maximum current to prevent overheating and potential failure.
  3. Operating Temperature (Topr):

    • The device operates reliably between -40°C and 85°C. Avoid operating outside this range to ensure stable performance.
  4. Storage Temperature (Tstg):

    • Store the device in an environment where the temperature ranges from -65°C to 150°C to maintain its integrity.
  5. Output Impedance (Rout):

    • The typical output impedance is 100Ω. This value should be considered when designing the load circuit to ensure proper matching and performance.
  6. Response Time (Tr):

    • The typical response time is 1μs. This is the time it takes for the device to respond to input changes. Design your system to accommodate this delay if necessary.
  7. Power Dissipation (Pd):

    • The typical power dissipation is 100mW. Ensure adequate heat dissipation or cooling if the device is expected to operate near this limit.
  8. Input Capacitance (Cin):

    • The typical input capacitance is 10pF. This value can affect the input signal characteristics, especially at high frequencies.
  9. Output Capacitance (Cout):

    • The typical output capacitance is 5pF. This should be considered when designing the output circuit to avoid signal degradation.

Additional Notes:

  • Always refer to the datasheet for the most accurate and detailed information.
  • Proper PCB layout and grounding practices should be followed to ensure optimal performance and reliability.
  • Regular testing and monitoring of the device under actual operating conditions are recommended to ensure long-term stability and performance.
(For reference only)

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