Instructions for Use:

1. Mounting: Ensure proper mounting to a heatsink if operating near maximum power dissipation to maintain junction temperature within safe limits.
2. Reverse Voltage Handling: Do not exceed the reverse breakdown voltage (V_R) to avoid damage to the device.
3. Forward Current: The forward current (I_F) should not exceed 1A continuously. For peak currents up to 10A, ensure the pulse duration is limited to 10ms with a 1% duty cycle.
4. Thermal Management: Monitor the junction temperature (T_J) to ensure it does not exceed 150°C. Use appropriate cooling methods if necessary.
5. Storage: Store the device in a dry environment within the specified storage temperature range (-65°C to 150°C).
6. Handling: Handle with care to avoid mechanical stress or damage to the leads. Use anti-static precautions to prevent electrostatic discharge (ESD) damage.
7. Soldering: Follow recommended soldering profiles to avoid thermal shock and ensure reliable connections. Typical reflow soldering temperatures should not exceed 260°C for more than 10 seconds.