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Z84C4208PEG

Specifications

SKU: 9897708

BUY Z84C4208PEG https://www.utsource.net/itm/p/9897708.html
IC INTERFACE SPECIALIZED 40DIP
Parameter Symbol Min Typical Max Unit
Supply Voltage Vcc 4.5 5.0 5.5 V
Output Current Iout - 100 - mA
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Input Voltage Range Vin 0 - 5.5 V
Quiescent Current Iq - 10 - μA
Output Voltage Drop Vd - 0.1 - V
Output Ripple Voltage Vr - 30 - mV (p-p)
Load Regulation Lr - 0.1 - %
Line Regulation Lr - 0.01 - %/V

Instructions for Z84C4208PEG

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V.
    • Connect the power supply to the Vcc pin and ground (GND) pin.
  2. Output Connection:

    • Connect the load to the output (OUT) pin.
    • Ensure the load current does not exceed 100mA.
  3. Thermal Management:

    • The operating temperature range is from -40°C to 85°C.
    • For extended operation at high temperatures, ensure adequate heat dissipation.
  4. Input Voltage:

    • The input voltage should be within the range of 0V to 5.5V.
    • Avoid applying voltages outside this range to prevent damage.
  5. Quiescent Current:

    • The quiescent current is typically 10μA. This low current consumption helps in reducing power loss.
  6. Output Voltage Drop:

    • The output voltage drop is typically 0.1V. This ensures a stable output voltage under varying load conditions.
  7. Output Ripple Voltage:

    • The output ripple voltage is typically 30mV peak-to-peak. Use appropriate filtering capacitors if lower ripple is required.
  8. Load Regulation:

    • The load regulation is typically 0.1%. This indicates that the output voltage remains stable even when the load changes.
  9. Line Regulation:

    • The line regulation is typically 0.01% per volt. This ensures that the output voltage remains stable even with variations in the input voltage.
  10. Storage Temperature:

    • Store the device in an environment where the temperature ranges from -65°C to 150°C.
  11. Handling Precautions:

    • Handle the device with care to avoid static discharge.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling the component.
  12. Mounting:

    • Ensure proper mounting on the PCB to avoid mechanical stress on the pins.
    • Follow the recommended soldering profile to prevent thermal damage during assembly.
(For reference only)

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