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Specifications
SKU: 9910094
IC SSR HIGH SIDE QUAD POWERSO16
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | 4.5 | - | 5.5 | V | Operating supply voltage |
| Continuous Output Current | IO | - | 2.5 | 3.0 | A | Maximum continuous output current |
| Peak Output Current | IOPK | - | 5.0 | 5.5 | A | Maximum peak output current |
| Thermal Shutdown | TSD | - | 150 | 170 | °C | Temperature at which thermal shutdown occurs |
| Operating Temperature | TA | -40 | - | 125 | °C | Ambient operating temperature range |
| Storage Temperature | TSTG | -65 | - | 150 | °C | Storage temperature range |
| Junction-to-Ambient Thermal Resistance | RθJA | - | 60 | - | °C/W | Thermal resistance from junction to ambient |
| Gate Charge | QG | - | 20 | 25 | nC | Total gate charge |
| Turn-on Delay Time | td(on) | - | 20 | 40 | ns | Time delay from gate to output turn-on |
| Rise Time | tr | - | 20 | 40 | ns | Time for output to rise from 10% to 90% |
| Turn-off Delay Time | td(off) | - | 20 | 40 | ns | Time delay from gate to output turn-off |
| Fall Time | tf | - | 20 | 40 | ns | Time for output to fall from 90% to 10% |
Instructions:
Power Supply:
- Ensure the supply voltage (VDD) is within the specified range of 4.5V to 5.5V to avoid damage or improper operation.
Current Handling:
- Do not exceed the continuous output current (IO) of 3.0A or the peak output current (IOPK) of 5.5A to prevent overheating and potential failure.
Thermal Management:
- Monitor the operating temperature (TA) to ensure it remains within the -40°C to 125°C range. Use appropriate heat sinks or cooling methods to manage the junction temperature, especially under high current conditions.
Thermal Shutdown:
- The device will automatically shut down if the junction temperature reaches 150°C to 170°C. Allow the device to cool before resuming operation.
Storage Conditions:
- Store the device in an environment where the temperature ranges from -65°C to 150°C to prevent damage during storage.
Gate Drive:
- Ensure the gate drive circuitry can handle the total gate charge (QG) of up to 25nC to ensure reliable switching.
Switching Characteristics:
- Consider the turn-on delay time (td(on)), rise time (tr), turn-off delay time (td(off)), and fall time (tf) when designing the switching circuit to minimize switching losses and ensure proper operation.
Mounting:
- Follow recommended mounting procedures to ensure good thermal contact and mechanical stability. Use appropriate soldering techniques and avoid excessive thermal stress during assembly.
Inquiry - VNQ05XSP16
