Specifications
SKU: 9974376
Parameter | Symbol | Min | Typ | Max | Unit | Notes |
---|---|---|---|---|---|---|
Supply Voltage | VDD | 2.0 | - | 5.5 | V | |
Operating Temperature | Toper | -40 | - | 125 | °C | |
Storage Temperature | Tstg | -65 | - | 150 | °C | |
Output Current per Channel | Iout | - | 200 | - | mA | |
Quiescent Current | IQ | - | 1.5 | - | mA | |
Input Capacitance | Cin | - | 10 | - | pF | |
Output Capacitance | Cout | - | 100 | - | pF | |
Thermal Resistance (θJA) | θJA | - | 75 | - | °C/W |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VDD) is within the range of 2.0V to 5.5V.
- Use appropriate decoupling capacitors close to the power pins to minimize noise.
Temperature Considerations:
- The device can operate over a temperature range from -40°C to 125°C.
- Store the device between -65°C and 150°C.
Output Current:
- Each channel can source or sink up to 200mA.
- Ensure that the total current does not exceed the maximum rating to avoid damage.
Quiescent Current:
- The typical quiescent current is 1.5mA. This value should be considered in low-power applications.
Capacitance:
- The input capacitance is typically 10pF, and the output capacitance is typically 100pF.
- These values can affect the performance in high-frequency applications.
Thermal Management:
- The thermal resistance (θJA) is 75°C/W. Ensure adequate heat dissipation, especially in high-power applications.
Handling and Storage:
- Handle the device with care to avoid static damage.
- Store in a dry environment to prevent moisture-related issues.
Mounting:
- Follow standard surface mount technology (SMT) procedures for mounting.
- Ensure proper soldering and alignment to avoid mechanical stress.
Testing:
- Test the device under specified operating conditions to ensure reliable performance.
- Use recommended test circuits and procedures to validate functionality.
Inquiry - SM8S33ATHE3/I